Hinge clamp positioning method for printed board processing
The invention discloses a hinge clamp positioning method for printed board processing. The method comprises the following steps of: preparing a base sheet, positioning edge strips and pre-positioning designing a special positioning pin, wherein during graphic making, the edge strips with the same th...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a hinge clamp positioning method for printed board processing. The method comprises the following steps of: preparing a base sheet, positioning edge strips and pre-positioning designing a special positioning pin, wherein during graphic making, the edge strips with the same thickness as a graphic making single sheet, the graphic making base sheet and the special positioningpin are assembled to form a complete set of hinge clamp type graphic positioning system for printed board graphic making. Due to the adoption of the positioning structure of the invention, the precision of the printed board graphic making is greatly improved, and high-precision interlayer graphic alignment for high-precision, high-density and high-multilayer printed circuit board graphic making is ensured. As the entire positioning system is formed by pre-designing and fit assembling, the positioning system is not influenced by human factors, environmental factors and processing factors of early stage processes, the a |
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