Adhesive composition and connection structure for circuit component using adhesive composition
The invention provides an adhesive composition, which can exhibit excellent adhesion strength even at a low temperature and under short curing conditions, and can sufficiently maintain characteristics of adhesion strength, connecting resistance and the like even after a reliability test (a long expo...
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| creator | KUDOU KEIKO IZAWA HIROYUKI KATOGI SHIGEKI |
| description | The invention provides an adhesive composition, which can exhibit excellent adhesion strength even at a low temperature and under short curing conditions, and can sufficiently maintain characteristics of adhesion strength, connecting resistance and the like even after a reliability test (a long exposure test under high temperature and high humidity conditions). The invention further provides a connection structure for a circuit component using the adhesive composition. The adhesive composition of the invention comprises (a) thermoplastic resins, (b) polymerizable compounds with free radicals, (c) dendrimers and (d) initiators for free radical polymerization, wherein the branch parts of the dendrimers are bonded dendritically at the core parts and the ends of the branch parts have end parts. |
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The invention further provides a connection structure for a circuit component using the adhesive composition. The adhesive composition of the invention comprises (a) thermoplastic resins, (b) polymerizable compounds with free radicals, (c) dendrimers and (d) initiators for free radical polymerization, wherein the branch parts of the dendrimers are bonded dendritically at the core parts and the ends of the branch parts have end parts.</description><language>chi ; eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CONDUCTORS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SEMICONDUCTOR DEVICES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110126&DB=EPODOC&CC=CN&NR=101955735A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110126&DB=EPODOC&CC=CN&NR=101955735A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDOU KEIKO</creatorcontrib><creatorcontrib>IZAWA HIROYUKI</creatorcontrib><creatorcontrib>KATOGI SHIGEKI</creatorcontrib><title>Adhesive composition and connection structure for circuit component using adhesive composition</title><description>The invention provides an adhesive composition, which can exhibit excellent adhesion strength even at a low temperature and under short curing conditions, and can sufficiently maintain characteristics of adhesion strength, connecting resistance and the like even after a reliability test (a long exposure test under high temperature and high humidity conditions). The invention further provides a connection structure for a circuit component using the adhesive composition. The adhesive composition of the invention comprises (a) thermoplastic resins, (b) polymerizable compounds with free radicals, (c) dendrimers and (d) initiators for free radical polymerization, wherein the branch parts of the dendrimers are bonded dendritically at the core parts and the ends of the branch parts have end parts.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIhzTMlILc4sS1VIzs8tyC_OLMnMz1NIzEsB8vPyUpPB3OKSotLkktKiVIW0_CKF5Myi5NLMEoiGvNS8EoXS4sy8dIVELCbxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DA0NLU1NzY1NHY2LUAADl1j3u</recordid><startdate>20110126</startdate><enddate>20110126</enddate><creator>KUDOU KEIKO</creator><creator>IZAWA HIROYUKI</creator><creator>KATOGI SHIGEKI</creator><scope>EVB</scope></search><sort><creationdate>20110126</creationdate><title>Adhesive composition and connection structure for circuit component using adhesive composition</title><author>KUDOU KEIKO ; IZAWA HIROYUKI ; KATOGI SHIGEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101955735A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDOU KEIKO</creatorcontrib><creatorcontrib>IZAWA HIROYUKI</creatorcontrib><creatorcontrib>KATOGI SHIGEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDOU KEIKO</au><au>IZAWA HIROYUKI</au><au>KATOGI SHIGEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Adhesive composition and connection structure for circuit component using adhesive composition</title><date>2011-01-26</date><risdate>2011</risdate><abstract>The invention provides an adhesive composition, which can exhibit excellent adhesion strength even at a low temperature and under short curing conditions, and can sufficiently maintain characteristics of adhesion strength, connecting resistance and the like even after a reliability test (a long exposure test under high temperature and high humidity conditions). The invention further provides a connection structure for a circuit component using the adhesive composition. The adhesive composition of the invention comprises (a) thermoplastic resins, (b) polymerizable compounds with free radicals, (c) dendrimers and (d) initiators for free radical polymerization, wherein the branch parts of the dendrimers are bonded dendritically at the core parts and the ends of the branch parts have end parts.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | Adhesive composition and connection structure for circuit component using adhesive composition |
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