Temperature rise design method of resin-encapsulated transformer winding

The invention relates to a temperature rise design method of a high-voltage and a low-voltage winding of a resin-encapsulated self-cooled transformer based on an actual average temperature rise model, belonging to the technical field of transformers. The invention comprises a manufacturing method of...

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Bibliographische Detailangaben
Hauptverfasser: HUA QINGHONG, WEI HAI, WEI HUA, WEI SHENGZHANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to a temperature rise design method of a high-voltage and a low-voltage winding of a resin-encapsulated self-cooled transformer based on an actual average temperature rise model, belonging to the technical field of transformers. The invention comprises a manufacturing method of the actual average temperature rise model and a method for designing temperature rise according to the model, which comprises the following steps: taking actually measured temperature rise parameter as a basis, manufacturing the actual average temperature rise model, using the model and the functional relation curve of the actual average temperature rise value delta Q and apparent thermal load q to design temperature rise. The invention can replace the traditional complicated calculation on heat conduction, convection and irradiation, fast design the average temperature rise value basically in line with the actual measurement value, greatly simplify the design procedures, save design time, and improve accuracy of