Trench-type Schottky-barrier diode rectifier and preparation method
The invention provides a trench-type Schottky-barrier diode rectifier and a preparation method. By using the two shoulders of a conducting poly-silicon T-shaped head in the trench and the silica layers on the extended sections to cover the vertex angles of boss structures on two sides of the trench,...
Gespeichert in:
Hauptverfasser: | , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | WANG FAN LIU WEI CHENG YICHUAN |
description | The invention provides a trench-type Schottky-barrier diode rectifier and a preparation method. By using the two shoulders of a conducting poly-silicon T-shaped head in the trench and the silica layers on the extended sections to cover the vertex angles of boss structures on two sides of the trench, the invention, based on the existing trench-type Schottky diode rectifiers, overcomes the problemsof increase in inverse current leakage and reduction in inverse blocking capacity caused by the tip discharge effect produced by contact of the vertex angles of the boss and an upper metal layer; moreover, by filling the trench with the conducting poly-silicon instead of aluminum, titanium and other conventional materials of the upper metal layer, on one hand, the invention solves the problem that the reliability of the rectifier is influenced by hollow cavities left during trench filling, and on the other hand, the invention provides more flexible design space for the ratio of the opening width to depth of the trench |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN101901808BB</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN101901808BB</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN101901808BB3</originalsourceid><addsrcrecordid>eNrjZHAOKUrNS87QLaksSFUITs7ILynJrtRNSiwqykwtUkjJzE9JVShKTS7JTAPxE_NSFAqKUgsSixJLMvPzFHJTSzLyU3gYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn6GBoaWBoYWBhZOTMVGKAAdaM0U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Trench-type Schottky-barrier diode rectifier and preparation method</title><source>esp@cenet</source><creator>WANG FAN ; LIU WEI ; CHENG YICHUAN</creator><creatorcontrib>WANG FAN ; LIU WEI ; CHENG YICHUAN</creatorcontrib><description>The invention provides a trench-type Schottky-barrier diode rectifier and a preparation method. By using the two shoulders of a conducting poly-silicon T-shaped head in the trench and the silica layers on the extended sections to cover the vertex angles of boss structures on two sides of the trench, the invention, based on the existing trench-type Schottky diode rectifiers, overcomes the problemsof increase in inverse current leakage and reduction in inverse blocking capacity caused by the tip discharge effect produced by contact of the vertex angles of the boss and an upper metal layer; moreover, by filling the trench with the conducting poly-silicon instead of aluminum, titanium and other conventional materials of the upper metal layer, on one hand, the invention solves the problem that the reliability of the rectifier is influenced by hollow cavities left during trench filling, and on the other hand, the invention provides more flexible design space for the ratio of the opening width to depth of the trench</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111109&DB=EPODOC&CC=CN&NR=101901808B$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20111109&DB=EPODOC&CC=CN&NR=101901808B$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG FAN</creatorcontrib><creatorcontrib>LIU WEI</creatorcontrib><creatorcontrib>CHENG YICHUAN</creatorcontrib><title>Trench-type Schottky-barrier diode rectifier and preparation method</title><description>The invention provides a trench-type Schottky-barrier diode rectifier and a preparation method. By using the two shoulders of a conducting poly-silicon T-shaped head in the trench and the silica layers on the extended sections to cover the vertex angles of boss structures on two sides of the trench, the invention, based on the existing trench-type Schottky diode rectifiers, overcomes the problemsof increase in inverse current leakage and reduction in inverse blocking capacity caused by the tip discharge effect produced by contact of the vertex angles of the boss and an upper metal layer; moreover, by filling the trench with the conducting poly-silicon instead of aluminum, titanium and other conventional materials of the upper metal layer, on one hand, the invention solves the problem that the reliability of the rectifier is influenced by hollow cavities left during trench filling, and on the other hand, the invention provides more flexible design space for the ratio of the opening width to depth of the trench</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAOKUrNS87QLaksSFUITs7ILynJrtRNSiwqykwtUkjJzE9JVShKTS7JTAPxE_NSFAqKUgsSixJLMvPzFHJTSzLyU3gYWNMSc4pTeaE0N4OSm2uIs4duakF-fGpxQWJyal5qSbyzn6GBoaWBoYWBhZOTMVGKAAdaM0U</recordid><startdate>20111109</startdate><enddate>20111109</enddate><creator>WANG FAN</creator><creator>LIU WEI</creator><creator>CHENG YICHUAN</creator><scope>EVB</scope></search><sort><creationdate>20111109</creationdate><title>Trench-type Schottky-barrier diode rectifier and preparation method</title><author>WANG FAN ; LIU WEI ; CHENG YICHUAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101901808BB3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG FAN</creatorcontrib><creatorcontrib>LIU WEI</creatorcontrib><creatorcontrib>CHENG YICHUAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG FAN</au><au>LIU WEI</au><au>CHENG YICHUAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Trench-type Schottky-barrier diode rectifier and preparation method</title><date>2011-11-09</date><risdate>2011</risdate><abstract>The invention provides a trench-type Schottky-barrier diode rectifier and a preparation method. By using the two shoulders of a conducting poly-silicon T-shaped head in the trench and the silica layers on the extended sections to cover the vertex angles of boss structures on two sides of the trench, the invention, based on the existing trench-type Schottky diode rectifiers, overcomes the problemsof increase in inverse current leakage and reduction in inverse blocking capacity caused by the tip discharge effect produced by contact of the vertex angles of the boss and an upper metal layer; moreover, by filling the trench with the conducting poly-silicon instead of aluminum, titanium and other conventional materials of the upper metal layer, on one hand, the invention solves the problem that the reliability of the rectifier is influenced by hollow cavities left during trench filling, and on the other hand, the invention provides more flexible design space for the ratio of the opening width to depth of the trench</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN101901808BB |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Trench-type Schottky-barrier diode rectifier and preparation method |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-16T13%3A38%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20FAN&rft.date=2011-11-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN101901808BB%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |