Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof

The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to...

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Hauptverfasser: WANG DEJUN, LU DAILIE, DU JIAQIN
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creator WANG DEJUN
LU DAILIE
DU JIAQIN
description The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN101894770A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN101894770A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN101894770A3</originalsourceid><addsrcrecordid>eNqNjbEKwkAQRNNYiPoP6wcEEhSipQTFSizsw3K3lxwmt2FvD_TvjWJjZzXD8GZmng1XoZwf3qJ6DjCQdmyBHUQavOFgk1EWGNHcsfWhBQwWhJO-fUzi0NAnG392enySQFSZ6kkItCMhdsts5rCPtPrqIlufjrf6nNPIDcXphQJpU1_Kotztt1VVHDb_MC_dWkMQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof</title><source>esp@cenet</source><creator>WANG DEJUN ; LU DAILIE ; DU JIAQIN</creator><creatorcontrib>WANG DEJUN ; LU DAILIE ; DU JIAQIN</creatorcontrib><description>The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2010</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101124&amp;DB=EPODOC&amp;CC=CN&amp;NR=101894770A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20101124&amp;DB=EPODOC&amp;CC=CN&amp;NR=101894770A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WANG DEJUN</creatorcontrib><creatorcontrib>LU DAILIE</creatorcontrib><creatorcontrib>DU JIAQIN</creatorcontrib><title>Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof</title><description>The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2010</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjbEKwkAQRNNYiPoP6wcEEhSipQTFSizsw3K3lxwmt2FvD_TvjWJjZzXD8GZmng1XoZwf3qJ6DjCQdmyBHUQavOFgk1EWGNHcsfWhBQwWhJO-fUzi0NAnG392enySQFSZ6kkItCMhdsts5rCPtPrqIlufjrf6nNPIDcXphQJpU1_Kotztt1VVHDb_MC_dWkMQ</recordid><startdate>20101124</startdate><enddate>20101124</enddate><creator>WANG DEJUN</creator><creator>LU DAILIE</creator><creator>DU JIAQIN</creator><scope>EVB</scope></search><sort><creationdate>20101124</creationdate><title>Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof</title><author>WANG DEJUN ; LU DAILIE ; DU JIAQIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101894770A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2010</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WANG DEJUN</creatorcontrib><creatorcontrib>LU DAILIE</creatorcontrib><creatorcontrib>DU JIAQIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WANG DEJUN</au><au>LU DAILIE</au><au>DU JIAQIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof</title><date>2010-11-24</date><risdate>2010</risdate><abstract>The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T19%3A21%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WANG%20DEJUN&rft.date=2010-11-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN101894770A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true