Pre-oxidation method of semiconductor packaging and routing surface and pre-oxidation layer structure thereof

The invention discloses a pre-oxidation method of a semiconductor packaging and routing surface and a pre-oxidation layer structure thereof. The pre-oxidation method comprises the following steps of: providing a lead and a routing joint surface, wherein one end of the lead is welded and combined to the routing joint surface to form a routing and combining part; providing an oxidizing gas for the routing and combining part to ensure that a pre-oxidation layer is formed on the routing joint surface on the routing and combining part and/or the surface of the lead; and packaging the lead, the routing joint surface, the pre-oxidation layer and the routing and combining part by utilizing a sealing glue material. Because the routing joint surface and/or the surface of the lead have/has the pre-oxidation layer, when the packaging procedure is carried out, the pre-oxidation layer can prevent the lead and/or the routing joint surface from being corroded, so that the risk of generating oxidation defects in the packaging