Epoxy resin composition capable of foaming at room temperature and preparation method thereof

The invention relates to an epoxy resin composition capable of foaming and curing at room temperature or curing below 60 DEG C and a preparation method thereof. The A component of the composition comprises epoxy resin, a modifier, pigments and fillers, the B component is a curing agent, and the C co...

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Hauptverfasser: BAI NANYAN, GUO GUIRONG, LI LIJUAN, ZHAO SHUYING, YU YI, HAN ZHANYUAN, YAN HUI
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creator BAI NANYAN
GUO GUIRONG
LI LIJUAN
ZHAO SHUYING
YU YI
HAN ZHANYUAN
YAN HUI
description The invention relates to an epoxy resin composition capable of foaming and curing at room temperature or curing below 60 DEG C and a preparation method thereof. The A component of the composition comprises epoxy resin, a modifier, pigments and fillers, the B component is a curing agent, and the C component comprises a foaming agent and a foam evening agent. The curing agent is aliphatic amine which is one or more than one compound(s) in a modified aliphatic amine curing agent, and the foaming agent is silicone oil. The proportion by weight of the three components is 100: 10-40: 1-5. The foaming temperature of the composition is 10-35 DEG C, and the curing process needs 2-7 days at the room temperature or 2 hours at 60 DEG C or 12-16 hours at the room temperature and 1-3 hours at 60 DEG C. The composition has good compression strength, impact strength and other mechanical properties, as well as good breakdown voltage strength and other electrical insulation performances after curing, and can be casted in situ,
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subjects AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title Epoxy resin composition capable of foaming at room temperature and preparation method thereof
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