Pressure-sensitive adhesive sheet for semiconductor wafer protection and method of applying the same

The present invention provides a pressure-sensitive adhesive sheet for semiconductor wafer protection and a method of applying the same. The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surf...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KAWASHIMA NORIYOSHI, ASAI FUMITERU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention provides a pressure-sensitive adhesive sheet for semiconductor wafer protection and a method of applying the same. The present invention provides a method of applying a pressure-sensitive adhesive sheet for semiconductor wafer protection, the method including applying to a surface of a semiconductor wafer a pressure-sensitive adhesive sheet for semiconductor wafer protection including a substrate, at least one interlayer, and a pressure-sensitive adhesive layer superposed in this order, in which the pressure-sensitive adhesive sheet is applied to the semiconductor wafer at an application temperature in the range of from 50 DEG C. to 100 DEG C. and the interlayer in contact with the pressure-sensitive adhesive layer has a loss tangent (tan [delta]) of 0.5 or larger at the application temperature.