Substrate structure and package structure using the same

A substrate structure and a package structure using the same are provided. The substrate structure includes a number of traces, a substrate core and a number of first metal tiles. The substrate core has a first surface and a second surface opposite to the first surface. The first metal tiles are dis...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE MINGIANG, FAN CHENUAN, CHEN KUO-HUA, LEE TSUNG-HSUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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