Method for forming a coating film

The object of the present disclosure is to provide a method for forming a coating film being able to reduce the time needed to cure coating film, reduce in size of coating equipments and reduce the amount of CO2 , without deterioration in such properties as water resistance and weather resistance. A...

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Bibliographische Detailangaben
Hauptverfasser:	SAITOU YOSHIHIKO, KAMITANI AKIRA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	The object of the present disclosure is to provide a method for forming a coating film being able to reduce the time needed to cure coating film, reduce in size of coating equipments and reduce the amount of CO2 , without deterioration in such properties as water resistance and weather resistance. A method for forming a coating film comprising a step (1) of applying a base coating composition, a step (2) of applying a top coating composition on the base coat layer obtained in said step (1), a step (3) of irradiating energy line on the uncured coating film obtained in said step (2), and a step (4) of bake curing after said step (3), wherein said top coating composition comprises a hydroxyl group-containing resin (A), an activation energy line-curable compound containing an unsaturated bond (B), and a polyisocyanate compound (C), said hydroxyl group-containing resin (A) has glass-transition temperature (Tg) of -20 to 50 DEG C, weight average molecular weight of 10000 to 30000, and hydroxyl group value of 80 to