Emi shielding/electrical grounding members

Exemplary embodiments are provided of EMI shielding/electrical grounding members configured to be installed to a substrate for interposition between electrically-conductive surfaces, for establishing electrical grounding contact from the substrate to the electrically-conductive surfaces. In one exem...

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Bibliographische Detailangaben

Hauptverfasser:	BALL SHELBY, HAMAND KARL
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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