Method for fabricating resin composition for semiconductor packaging

The present invention relates to a method for fabricating a resin composition for semiconductor packaging, wherein the resin composition comprises the following components (A) to (C): (A) epoxy resin;(B) curing agent; and (C) inorganic filler. The method comprises the following steps: preparing a mi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIMURA SHOICHI, MINORU YAMANE, HIROFUMI OONO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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