Shape memory based mechanical enabling mechanism
The invention describes semiconductor packages and fabrication methods thereof. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is de-coupled from a socket and a circuit board....
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| creator | SANE SANDEEP GANAPATHYSUBRAMANIAN SHANKAR |
| description | The invention describes semiconductor packages and fabrication methods thereof. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is de-coupled from a socket and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is decoupled from a substrate. A decoupling assembly includes a clamping device, springs, and shape memory alloy rods. The shape memory alloy rods are actuators that generate motion or a pre-programmed shape to apply force when thermally excited. When the thermal excitation or other stimulus is removed, the shape memory alloy rods tend to return to their original shape, thus relieving any load or motion generated. |
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The decoupling assembly engages in response to a stimulus such that a semiconductor die is de-coupled from a socket and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is decoupled from a substrate. A decoupling assembly includes a clamping device, springs, and shape memory alloy rods. The shape memory alloy rods are actuators that generate motion or a pre-programmed shape to apply force when thermally excited. When the thermal excitation or other stimulus is removed, the shape memory alloy rods tend to return to their original shape, thus relieving any load or motion generated.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090826&DB=EPODOC&CC=CN&NR=101517735A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090826&DB=EPODOC&CC=CN&NR=101517735A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SANE SANDEEP</creatorcontrib><creatorcontrib>GANAPATHYSUBRAMANIAN SHANKAR</creatorcontrib><title>Shape memory based mechanical enabling mechanism</title><description>The invention describes semiconductor packages and fabrication methods thereof. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is de-coupled from a socket and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is decoupled from a substrate. A decoupling assembly includes a clamping device, springs, and shape memory alloy rods. The shape memory alloy rods are actuators that generate motion or a pre-programmed shape to apply force when thermally excited. When the thermal excitation or other stimulus is removed, the shape memory alloy rods tend to return to their original shape, thus relieving any load or motion generated.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAIzkgsSFXITc3NL6pUSEosTk0BcpIzEvMykxNzFFLzEpNyMvPSYWLFuTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN7Zz9DA0NTQ3NzY1NGYGDUAVJorNg</recordid><startdate>20090826</startdate><enddate>20090826</enddate><creator>SANE SANDEEP</creator><creator>GANAPATHYSUBRAMANIAN SHANKAR</creator><scope>EVB</scope></search><sort><creationdate>20090826</creationdate><title>Shape memory based mechanical enabling mechanism</title><author>SANE SANDEEP ; GANAPATHYSUBRAMANIAN SHANKAR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101517735A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SANE SANDEEP</creatorcontrib><creatorcontrib>GANAPATHYSUBRAMANIAN SHANKAR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SANE SANDEEP</au><au>GANAPATHYSUBRAMANIAN SHANKAR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Shape memory based mechanical enabling mechanism</title><date>2009-08-26</date><risdate>2009</risdate><abstract>The invention describes semiconductor packages and fabrication methods thereof. A decoupling assembly is disposed between a package substrate and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is de-coupled from a socket and a circuit board. The decoupling assembly engages in response to a stimulus such that a semiconductor die is decoupled from a substrate. A decoupling assembly includes a clamping device, springs, and shape memory alloy rods. The shape memory alloy rods are actuators that generate motion or a pre-programmed shape to apply force when thermally excited. When the thermal excitation or other stimulus is removed, the shape memory alloy rods tend to return to their original shape, thus relieving any load or motion generated.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Shape memory based mechanical enabling mechanism |
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