Tin-based lead-free solder and preparing method thereof

The invention relates to a tin-based lead-free solder and a preparing method thereof, the tin-based lead-free solder contains, based on weight percentage, 0.005-0.5% of gallium, 0.1-1% of silver, 0.1-1% of copper, 0.001-0.5% of phosphor and tin as the balance. The method for preparing the tin-based...

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Bibliographische Detailangaben
1. Verfasser:	LIN SHICONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a tin-based lead-free solder and a preparing method thereof, the tin-based lead-free solder contains, based on weight percentage, 0.005-0.5% of gallium, 0.1-1% of silver, 0.1-1% of copper, 0.001-0.5% of phosphor and tin as the balance. The method for preparing the tin-based lead-free solder comprises the steps of: first of all, preparing four intermediate alloy ingots including tin-gallium, tin-silver, tin-copper and tin-phosphor; adding the four intermediate alloy ingots according to particular weight parts and then additionally adding the balancing tin; in the meantime, adding the mixture into a manganese alloy pot for melting, and heating up to 450 DEG C; discharging, cooling and casting into the lead-free solder so as to obtain the lead-free solder that contains gallium, silver, copper and phosphor with tin being the balance. The invention has the advantage that the lead-free solder is low in melting point, excellent in wettability, bright in soldering spot, persistent in anti-oxi