Semiconductor device, its manufacturing method and its testing method

A semiconductor device for SiP or PoP for downsizing, a method of manufacturing it, and a testing method suitable for SiP and PoP in which the simplification of a system and the enhancement of its efficiency are achieved are provided. A first semiconductor device including a first memory circuit det...

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Hauptverfasser: SEITO AKIRA, TANAKA TASUKE, HAMADA KANYA, NAKAJIMA YOSHIAKI
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creator SEITO AKIRA
TANAKA TASUKE
HAMADA KANYA
NAKAJIMA YOSHIAKI
description A semiconductor device for SiP or PoP for downsizing, a method of manufacturing it, and a testing method suitable for SiP and PoP in which the simplification of a system and the enhancement of its efficiency are achieved are provided. A first semiconductor device including a first memory circuit determined as non-defective and a second semiconductor device including a second memory circuit and a signal processing circuit carrying out signal processing according to a program, determined as non-defective are sorted. The sorted devices are assembled as an integral semiconductor device. On a board for testing, a clock signal equivalent to the actual operation of the semiconductor device is supplied. A test program for conducting a performance test on the first memory circuit is written from a tester to the second memory circuit of the second semiconductor device. In the signal processing circuit, a performance test is conducted on the first memory circuit according to the written test program in correspondence wi
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language chi ; eng
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
TESTING
title Semiconductor device, its manufacturing method and its testing method
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