Luminous element and preparation method thereof

Luminous element and preparation method thereof

The invention discloses a luminous element and a preparation method thereof. The luminous element comprises a base plate, a luminous chip, a tubular structure and a fluorescence-converting layer. The tubular structure is formed on the surface of the base plate; the luminous chip is arranged on the s...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GUO JIATAI, LU JIANJUN, SUN JIANREN, XU ZHENPENG, HU HONGLIE
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator GUO JIATAI
LU JIANJUN
SUN JIANREN
XU ZHENPENG
HU HONGLIE
description The invention discloses a luminous element and a preparation method thereof. The luminous element comprises a base plate, a luminous chip, a tubular structure and a fluorescence-converting layer. The tubular structure is formed on the surface of the base plate; the luminous chip is arranged on the surface of the base plate and is encircled by the tubular structure; the fluorescence-converting layer is arranged in the tubular structure and covers the luminous chip. The ratio of the largest vertical thickness and the largest horizontal thickness of the fluorescence-converting layer at the luminous chip part is 0.1-10. In the invention, the distance that light rays can penetrate through the fluorescence-converting layer after the luminous chip emits the light rays is controlled by the tubular structure, thus solving the problem of uneven color temperature of the light rays caused by the fluorescent powder spread coating encapsulation technology in the prior art.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN101447538A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN101447538A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN101447538A3</originalsourceid><addsrcrecordid>eNrjZND3Kc3NzMsvLVZIzUnNTc0rUUjMS1EoKEotSCxKLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGhiYm5qbGFo7GxKgBAFRRK0Q</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Luminous element and preparation method thereof</title><source>esp@cenet</source><creator>GUO JIATAI ; LU JIANJUN ; SUN JIANREN ; XU ZHENPENG ; HU HONGLIE</creator><creatorcontrib>GUO JIATAI ; LU JIANJUN ; SUN JIANREN ; XU ZHENPENG ; HU HONGLIE</creatorcontrib><description>The invention discloses a luminous element and a preparation method thereof. The luminous element comprises a base plate, a luminous chip, a tubular structure and a fluorescence-converting layer. The tubular structure is formed on the surface of the base plate; the luminous chip is arranged on the surface of the base plate and is encircled by the tubular structure; the fluorescence-converting layer is arranged in the tubular structure and covers the luminous chip. The ratio of the largest vertical thickness and the largest horizontal thickness of the fluorescence-converting layer at the luminous chip part is 0.1-10. In the invention, the distance that light rays can penetrate through the fluorescence-converting layer after the luminous chip emits the light rays is controlled by the tubular structure, thus solving the problem of uneven color temperature of the light rays caused by the fluorescent powder spread coating encapsulation technology in the prior art.</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090603&amp;DB=EPODOC&amp;CC=CN&amp;NR=101447538A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20090603&amp;DB=EPODOC&amp;CC=CN&amp;NR=101447538A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUO JIATAI</creatorcontrib><creatorcontrib>LU JIANJUN</creatorcontrib><creatorcontrib>SUN JIANREN</creatorcontrib><creatorcontrib>XU ZHENPENG</creatorcontrib><creatorcontrib>HU HONGLIE</creatorcontrib><title>Luminous element and preparation method thereof</title><description>The invention discloses a luminous element and a preparation method thereof. The luminous element comprises a base plate, a luminous chip, a tubular structure and a fluorescence-converting layer. The tubular structure is formed on the surface of the base plate; the luminous chip is arranged on the surface of the base plate and is encircled by the tubular structure; the fluorescence-converting layer is arranged in the tubular structure and covers the luminous chip. The ratio of the largest vertical thickness and the largest horizontal thickness of the fluorescence-converting layer at the luminous chip part is 0.1-10. In the invention, the distance that light rays can penetrate through the fluorescence-converting layer after the luminous chip emits the light rays is controlled by the tubular structure, thus solving the problem of uneven color temperature of the light rays caused by the fluorescent powder spread coating encapsulation technology in the prior art.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND3Kc3NzMsvLVZIzUnNTc0rUUjMS1EoKEotSCxKLMnMz1PITS3JyE9RKMlILUrNT-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoYGhiYm5qbGFo7GxKgBAFRRK0Q</recordid><startdate>20090603</startdate><enddate>20090603</enddate><creator>GUO JIATAI</creator><creator>LU JIANJUN</creator><creator>SUN JIANREN</creator><creator>XU ZHENPENG</creator><creator>HU HONGLIE</creator><scope>EVB</scope></search><sort><creationdate>20090603</creationdate><title>Luminous element and preparation method thereof</title><author>GUO JIATAI ; LU JIANJUN ; SUN JIANREN ; XU ZHENPENG ; HU HONGLIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101447538A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>GUO JIATAI</creatorcontrib><creatorcontrib>LU JIANJUN</creatorcontrib><creatorcontrib>SUN JIANREN</creatorcontrib><creatorcontrib>XU ZHENPENG</creatorcontrib><creatorcontrib>HU HONGLIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUO JIATAI</au><au>LU JIANJUN</au><au>SUN JIANREN</au><au>XU ZHENPENG</au><au>HU HONGLIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Luminous element and preparation method thereof</title><date>2009-06-03</date><risdate>2009</risdate><abstract>The invention discloses a luminous element and a preparation method thereof. The luminous element comprises a base plate, a luminous chip, a tubular structure and a fluorescence-converting layer. The tubular structure is formed on the surface of the base plate; the luminous chip is arranged on the surface of the base plate and is encircled by the tubular structure; the fluorescence-converting layer is arranged in the tubular structure and covers the luminous chip. The ratio of the largest vertical thickness and the largest horizontal thickness of the fluorescence-converting layer at the luminous chip part is 0.1-10. In the invention, the distance that light rays can penetrate through the fluorescence-converting layer after the luminous chip emits the light rays is controlled by the tubular structure, thus solving the problem of uneven color temperature of the light rays caused by the fluorescent powder spread coating encapsulation technology in the prior art.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN101447538A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Luminous element and preparation method thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-09T00%3A12%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GUO%20JIATAI&rft.date=2009-06-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN101447538A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true