Heat radiating device used for semiconductor power module

The invention provides a heat sink which is equipped with a projection part of a plate-shaped part of a semiconductor power module at the lower part of a semiconductor chip. As the heat generated by the semiconductor chip is absorbed by the projection part of the plate-shaped part of the heat sink,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ONU NAOTO, MIGATA FUMIAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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