Heat radiating device used for semiconductor power module

The invention provides a heat sink which is equipped with a projection part of a plate-shaped part of a semiconductor power module at the lower part of a semiconductor chip. As the heat generated by the semiconductor chip is absorbed by the projection part of the plate-shaped part of the heat sink,...

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Hauptverfasser:	ONU NAOTO, MIGATA FUMIAKI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	ONU NAOTO MIGATA FUMIAKI
description	The invention provides a heat sink which is equipped with a projection part of a plate-shaped part of a semiconductor power module at the lower part of a semiconductor chip. As the heat generated by the semiconductor chip is absorbed by the projection part of the plate-shaped part of the heat sink, the temperature rise of the semiconductor chip is slowed, thus alleviating the thermal stress exerted on the semiconductor chip, and further alleviating the thermal stress exerted on the semiconductor chip of the semiconductor power module.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	Heat radiating device used for semiconductor power module
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