Titanium alloy high bond strength gold plating process

Titanium alloy high bond strength gold plating process

The invention relates to a high-bonding strength gilding technology of a titanium alloy, which comprises the processes of pickling, cathode activation, chemical nickel plating, low stress nickel electroplating, impact gilding, electrogilding and drying. Starting from electroplating pretreatment and...

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Hauptverfasser: CHEN PAIMING, LIN BAICHUN, WANG GUOYANG
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Sprache:chi ; eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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creator CHEN PAIMING
LIN BAICHUN
WANG GUOYANG
description The invention relates to a high-bonding strength gilding technology of a titanium alloy, which comprises the processes of pickling, cathode activation, chemical nickel plating, low stress nickel electroplating, impact gilding, electrogilding and drying. Starting from electroplating pretreatment and gilding technology, the invention researches a pickling technology which can fully dissolve the oxide films of titanium and aluminum, cathode activating technology and chemical nickel plating, and low stress nickel electrogilding technology and impact gilding technology, thus solving a series of problems affecting the bonding force of a gilding coating that the titanium alloy is oxidized again before electroplating and after pickling; a hydrolysate film is generated in a water scrubbing process after the pickling, a loosen displacement coating is generated in chemical plating and electrogilding processes and the like, and finally a gilding coating fixedly bound on the titanium alloy surface is obtained, thus expand
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title Titanium alloy high bond strength gold plating process
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