Double-sided flexible copper-clad laminated substrate and method of producing double-sided flexible copper-clad laminated substrate with carrier

A manufacturing method for a both-side flexible-copper-laminated board is disclosed, which is a manufacturing method for a both-side flexible-copper-laminated board that has extremely thin copper foil on both sides thereof, the extremely thin copper foil is formed by peeling of a carrier on the carr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UENO MASATO, TAKARABE TAEKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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