Double-sided flexible copper-clad laminated substrate and method of producing double-sided flexible copper-clad laminated substrate with carrier
A manufacturing method for a both-side flexible-copper-laminated board is disclosed, which is a manufacturing method for a both-side flexible-copper-laminated board that has extremely thin copper foil on both sides thereof, the extremely thin copper foil is formed by peeling of a carrier on the carr...
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| creator | UENO MASATO TAKARABE TAEKO |
| description | A manufacturing method for a both-side flexible-copper-laminated board is disclosed, which is a manufacturing method for a both-side flexible-copper-laminated board that has extremely thin copper foil on both sides thereof, the extremely thin copper foil is formed by peeling of a carrier on the carrier-bearing extremely thin copper foil that is formed via a peeling-off layer on the carrier. The method comprises the steps of: forming a polyimide resin layer on the surface of the carrier-bearing extremely thin copper foil to attain a carrier-bearing single-side flexible-copper-laminated board; implementing annealing treatment to the carrier-bearing extremely thin copper foil; laminating the carrier-bearing extremely thin copper foil subjected to the annealing treatment, on the surface of the polyimide resin layer of the carrier-bearing single-side flexible-copper-laminated board with the carrier being as outer side, so as to acquire the carrier-bearing both-side flexible-copper-laminated board; peeling off the |
| format | Patent |
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The method comprises the steps of: forming a polyimide resin layer on the surface of the carrier-bearing extremely thin copper foil to attain a carrier-bearing single-side flexible-copper-laminated board; implementing annealing treatment to the carrier-bearing extremely thin copper foil; laminating the carrier-bearing extremely thin copper foil subjected to the annealing treatment, on the surface of the polyimide resin layer of the carrier-bearing single-side flexible-copper-laminated board with the carrier being as outer side, so as to acquire the carrier-bearing both-side flexible-copper-laminated board; peeling off the</description><language>chi ; eng</language><subject>CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS ; CHEMISTRY ; FERROUS OR NON-FERROUS ALLOYS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; PERFORMING OPERATIONS ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090401&DB=EPODOC&CC=CN&NR=101396895A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090401&DB=EPODOC&CC=CN&NR=101396895A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>UENO MASATO</creatorcontrib><creatorcontrib>TAKARABE TAEKO</creatorcontrib><title>Double-sided flexible copper-clad laminated substrate and method of producing double-sided flexible copper-clad laminated substrate with carrier</title><description>A manufacturing method for a both-side flexible-copper-laminated board is disclosed, which is a manufacturing method for a both-side flexible-copper-laminated board that has extremely thin copper foil on both sides thereof, the extremely thin copper foil is formed by peeling of a carrier on the carrier-bearing extremely thin copper foil that is formed via a peeling-off layer on the carrier. 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The method comprises the steps of: forming a polyimide resin layer on the surface of the carrier-bearing extremely thin copper foil to attain a carrier-bearing single-side flexible-copper-laminated board; implementing annealing treatment to the carrier-bearing extremely thin copper foil; laminating the carrier-bearing extremely thin copper foil subjected to the annealing treatment, on the surface of the polyimide resin layer of the carrier-bearing single-side flexible-copper-laminated board with the carrier being as outer side, so as to acquire the carrier-bearing both-side flexible-copper-laminated board; peeling off the</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN101396895A |
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| subjects | CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS |
| title | Double-sided flexible copper-clad laminated substrate and method of producing double-sided flexible copper-clad laminated substrate with carrier |
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