Semiconductor package and manufacturing method thereof

The invention discloses a semiconductor packaging part and a manufacturing method thereof. The semiconductor packaging part provides a carrier which is provided with a plurality of connecting pads on the surface so as to position the carrier on the lower surface of a lead frame chip holder correspon...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHAN CHANGYUE, LAI ZHIXING, HUANG ZHIMING, LI CHUNYUAN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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