Metal polishing liquid and method for polishing film to be polished

Disclosed is a metal polishing liquid which enables a CMP with a high Cu polishing rate, while resolving the problems such as (a) polishing scratches caused by solid particles, (b) deterioration in planarity such as dishing and erosion, (c) complication of the cleaning step for removing polishing pa...

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Bibliographische Detailangaben
Hauptverfasser:	MABUCHI KATSUMI, SAKURADA TAKAFUMI, NOMURA YUTAKA, NAKAGAWA HIROSHI, TOBITA FUMIKO, ANZAI SOU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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