Solder deposition and thermal processing of thin-die thermal interface material

A solder is deposited on a heat sink. The solder is first reflowed at a first temperature that is below about 120 DEG C. The solder is second heat aged at a temperature that causes the first reflowed solder to have an increased second reflow temperature. The heat aging process results in less compre...

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1. Verfasser: RENAVIKAR MUKUL
Format: Patent
Sprache:chi ; eng
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