Etching method of metal wire

The invention provides a metal wire etching method which is applicable on a plasma etching device which is provided with an etching cavity and a tripping cavity. A holder platform for placing a wafer and a lifting and supporting mechanism for lifting and supporting the wafer are arranged inside the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG JINGJING, LOU FENGRUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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