Single loading mechanism to apply force to both cooling apparatus and integrated circuit package

Single loading mechanism to apply force to both cooling apparatus and integrated circuit package

Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechan...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MISTKAWI MANDY, ILA ALIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Embodiments of the invention provide single loading mechanism that both pushes a semiconductor package against a socket and pushes a cooling solution against the semiconductor package. This loading mechanism may take up less motherboard real estate than if two different attachment and loading mechanisms were used.