Insulating circuit board and insulating circuit board provided with cooling sink section
An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate...
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creator | KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA |
description | An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a/b=1 is satisfied. An insulating circuit board provided with a cooling sink section has the insulating circuit board, and a cooling sink section bonded to the metal plate through a second solder layer. The second solder layer is formed of a solder having Sn as a main ingredient, with a Young's modulus of, for instance, 35GPa or more, a 0.2% proof strength of, for instance, 30MPa or more, and a tensile strength of, for instance, 40MPa or more. The cooling sink section is formed of, for instance, pure Al or an Al alloy. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN101061580A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN101061580A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN101061580A3</originalsourceid><addsrcrecordid>eNrjZIjwzCsuzUksycxLV0jOLEouzSxRSMpPLEpRSMxLUcjEJVlQlF-WmZKaolCeWZKhkJyfnwNSU5yZl61QnJpckpmfx8PAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA0MDcwMTS0MHI2JUQMA5ng6vg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Insulating circuit board and insulating circuit board provided with cooling sink section</title><source>esp@cenet</source><creator>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</creator><creatorcontrib>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</creatorcontrib><description>An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a/b=1 is satisfied. An insulating circuit board provided with a cooling sink section has the insulating circuit board, and a cooling sink section bonded to the metal plate through a second solder layer. The second solder layer is formed of a solder having Sn as a main ingredient, with a Young's modulus of, for instance, 35GPa or more, a 0.2% proof strength of, for instance, 30MPa or more, and a tensile strength of, for instance, 40MPa or more. The cooling sink section is formed of, for instance, pure Al or an Al alloy.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071024&DB=EPODOC&CC=CN&NR=101061580A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071024&DB=EPODOC&CC=CN&NR=101061580A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</creatorcontrib><title>Insulating circuit board and insulating circuit board provided with cooling sink section</title><description>An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a/b=1 is satisfied. An insulating circuit board provided with a cooling sink section has the insulating circuit board, and a cooling sink section bonded to the metal plate through a second solder layer. The second solder layer is formed of a solder having Sn as a main ingredient, with a Young's modulus of, for instance, 35GPa or more, a 0.2% proof strength of, for instance, 30MPa or more, and a tensile strength of, for instance, 40MPa or more. The cooling sink section is formed of, for instance, pure Al or an Al alloy.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIjwzCsuzUksycxLV0jOLEouzSxRSMpPLEpRSMxLUcjEJVlQlF-WmZKaolCeWZKhkJyfnwNSU5yZl61QnJpckpmfx8PAmpaYU5zKC6W5GRTdXEOcPXRTC_LjU4sLEpNT81JL4p39DA0MDcwMTS0MHI2JUQMA5ng6vg</recordid><startdate>20071024</startdate><enddate>20071024</enddate><creator>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</creator><scope>EVB</scope></search><sort><creationdate>20071024</creationdate><title>Insulating circuit board and insulating circuit board provided with cooling sink section</title><author>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101061580A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUROMITSU YOSHIROU,TORIUMI MAKOTO,NAGATOMO YOSHIYUKI,ISHIZUKA HIROYA,BABA YOUICHIRO,WATANABE TOMOYUKI,YASUI TAKUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Insulating circuit board and insulating circuit board provided with cooling sink section</title><date>2007-10-24</date><risdate>2007</risdate><abstract>An insulating circuit board is provided with an insulating board, a circuit board bonded to a first plane of the insulating board, and a metal plate bonded to a second plane of the insulating board. The circuit board is formed of an Al alloy having a purity of 99.98% or pure Al, and the metal plate is formed of an Al alloy having a purity of 98.00% but not more than 99.90%. A thickness (a) of the circuit board is, for instance, 0.2mm or more but not more than 0.8mm, and a thickness (b) of the metal plate is, for instance, 0.6mm or more but not more than 1.5mm, and an inequality of a/b=1 is satisfied. An insulating circuit board provided with a cooling sink section has the insulating circuit board, and a cooling sink section bonded to the metal plate through a second solder layer. The second solder layer is formed of a solder having Sn as a main ingredient, with a Young's modulus of, for instance, 35GPa or more, a 0.2% proof strength of, for instance, 30MPa or more, and a tensile strength of, for instance, 40MPa or more. The cooling sink section is formed of, for instance, pure Al or an Al alloy.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Insulating circuit board and insulating circuit board provided with cooling sink section |
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