Molding apparatus

A lower punch is arranged to be inserted into a cavity of a die from a lower side of the die. A upper punch is arranged to be inserted into the cavity from an upper side of the die to compact the powder filled in the cavity, in cooperation with the lower punch. A feeder supplies the powder into the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SATOH TAKASHI,SATOH SADAKI,KIKUCHI KEN,GOTOH MASASHI,ITOH TAKESHI,KATAHO TAKUO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!