Polishing pad, method of polishing and polishing apparatus
A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predete...
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| creator | NAKAGAWA YASUTADA,KOIKE EIJIRO |
| description | A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad. |
| format | Patent |
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DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071003&DB=EPODOC&CC=CN&NR=101045290A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20071003&DB=EPODOC&CC=CN&NR=101045290A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAGAWA YASUTADA,KOIKE EIJIRO</creatorcontrib><title>Polishing pad, method of polishing and polishing apparatus</title><description>A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKyM_JLM7IzEtXKEhM0VHITS3JyE9RyE9TKIBLJOalIPMKChKLEktKi3kYWNMSc4pTeaE0N4Oim2uIs4duakF-fGpxQWJyal5qSbyzn6GBoYGJqZGlgaMxMWoAaAgu7w</recordid><startdate>20071003</startdate><enddate>20071003</enddate><creator>NAKAGAWA YASUTADA,KOIKE EIJIRO</creator><scope>EVB</scope></search><sort><creationdate>20071003</creationdate><title>Polishing pad, method of polishing and polishing apparatus</title><author>NAKAGAWA YASUTADA,KOIKE EIJIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101045290A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKAGAWA YASUTADA,KOIKE EIJIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKAGAWA YASUTADA,KOIKE EIJIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Polishing pad, method of polishing and polishing apparatus</title><date>2007-10-03</date><risdate>2007</risdate><abstract>A polishing pad according to the invention comprises a pad body having a polishing surface and a support surface and a plurality of hole apertures extending from the polishing surface to the support surface, each of the plurality of apertures having a noncircular shaped opening oriented at a predetermined angle with respect to a radial direction of the polishing pad.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
| recordid | cdi_epo_espacenet_CN101045290A |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | Polishing pad, method of polishing and polishing apparatus |
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