Retaining and heat dissipating structure for electronic equipment

Retaining and heat dissipating structure for electronic equipment

A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 )...

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Hauptverfasser: BOER FABRIZIO, BISERNI MARIO
Format: Patent
Sprache:chi ; eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator BOER FABRIZIO
BISERNI MARIO
description A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN100431398CC</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN100431398CC</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN100431398CC3</originalsourceid><addsrcrecordid>eNqNyrEKwjAQh_EuDqK-w-EutMRBxxIUJwdxL0f6rx7US0wu7y-CD-D0wY9v2fQ3GIuKPoh1pCfYaJRSJLF9sViuwWoGTTETZgTLUSUQ3lXSC2rrZjHxXLD5ddVsz6e7v-yQ4oCSOEBhg792bbt3nTsevHd_TR-u4TLb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Retaining and heat dissipating structure for electronic equipment</title><source>esp@cenet</source><creator>BOER FABRIZIO ; BISERNI MARIO</creator><creatorcontrib>BOER FABRIZIO ; BISERNI MARIO</creatorcontrib><description>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20081105&amp;DB=EPODOC&amp;CC=CN&amp;NR=100431398C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20081105&amp;DB=EPODOC&amp;CC=CN&amp;NR=100431398C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BOER FABRIZIO</creatorcontrib><creatorcontrib>BISERNI MARIO</creatorcontrib><title>Retaining and heat dissipating structure for electronic equipment</title><description>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQh_EuDqK-w-EutMRBxxIUJwdxL0f6rx7US0wu7y-CD-D0wY9v2fQ3GIuKPoh1pCfYaJRSJLF9sViuwWoGTTETZgTLUSUQ3lXSC2rrZjHxXLD5ddVsz6e7v-yQ4oCSOEBhg792bbt3nTsevHd_TR-u4TLb</recordid><startdate>20081105</startdate><enddate>20081105</enddate><creator>BOER FABRIZIO</creator><creator>BISERNI MARIO</creator><scope>EVB</scope></search><sort><creationdate>20081105</creationdate><title>Retaining and heat dissipating structure for electronic equipment</title><author>BOER FABRIZIO ; BISERNI MARIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN100431398CC3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2008</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>BOER FABRIZIO</creatorcontrib><creatorcontrib>BISERNI MARIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BOER FABRIZIO</au><au>BISERNI MARIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Retaining and heat dissipating structure for electronic equipment</title><date>2008-11-05</date><risdate>2008</risdate><abstract>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</abstract><oa>free_for_read</oa></addata></record>
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language chi ; eng
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source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Retaining and heat dissipating structure for electronic equipment
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-21T15%3A16%3A23IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BOER%20FABRIZIO&rft.date=2008-11-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN100431398CC%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true