Estructura de película de barrera multicapa termoestable
Una película de barrera duradera que incluye una capa de sustrato polimérica que tiene un espesor entre 10 y 100 µm, una capa de recubrimiento inorgánica y una capa amortiguadora polimérica situada entre la capa de sustrato polimérica y la capa de recubrimiento inorgánica, la capa amortiguadora poli...
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| creator | CHRISTOPHERSON, Roy ETTRIDGE, Peter OKLE, Philipp LOHWASSER, Wolfgang |
| description | Una película de barrera duradera que incluye una capa de sustrato polimérica que tiene un espesor entre 10 y 100 µm, una capa de recubrimiento inorgánica y una capa amortiguadora polimérica situada entre la capa de sustrato polimérica y la capa de recubrimiento inorgánica, la capa amortiguadora polimérica en contacto directo con la capa de recubrimiento inorgánica, en donde la capa de recubrimiento inorgánica comprende una estructura de onda caracterizada por una amplitud promedio entre 0,25 y 1,0 µm y una longitud de onda entre 2 y 5 µm.
This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film. |
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This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.</description><language>spa</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231006&DB=EPODOC&CC=CL&NR=2023000668A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231006&DB=EPODOC&CC=CL&NR=2023000668A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHRISTOPHERSON, Roy</creatorcontrib><creatorcontrib>ETTRIDGE, Peter</creatorcontrib><creatorcontrib>OKLE, Philipp</creatorcontrib><creatorcontrib>LOHWASSER, Wolfgang</creatorcontrib><title>Estructura de película de barrera multicapa termoestable</title><description>Una película de barrera duradera que incluye una capa de sustrato polimérica que tiene un espesor entre 10 y 100 µm, una capa de recubrimiento inorgánica y una capa amortiguadora polimérica situada entre la capa de sustrato polimérica y la capa de recubrimiento inorgánica, la capa amortiguadora polimérica en contacto directo con la capa de recubrimiento inorgánica, en donde la capa de recubrimiento inorgánica comprende una estructura de onda caracterizada por una amplitud promedio entre 0,25 y 1,0 µm y una longitud de onda entre 2 y 5 µm.
This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB0LS4pKk0uKS1KVEhJVShIzTm8Nrk0B8xJSiwqSgWK55bmlGQmJxYkKpSkFuXmpxaXJCblpPIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknhnHyMDI2MDAwMzMwtHQ2PiVAEAayowWA</recordid><startdate>20231006</startdate><enddate>20231006</enddate><creator>CHRISTOPHERSON, Roy</creator><creator>ETTRIDGE, Peter</creator><creator>OKLE, Philipp</creator><creator>LOHWASSER, Wolfgang</creator><scope>EVB</scope></search><sort><creationdate>20231006</creationdate><title>Estructura de película de barrera multicapa termoestable</title><author>CHRISTOPHERSON, Roy ; ETTRIDGE, Peter ; OKLE, Philipp ; LOHWASSER, Wolfgang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CL2023000668A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>spa</language><creationdate>2023</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>CHRISTOPHERSON, Roy</creatorcontrib><creatorcontrib>ETTRIDGE, Peter</creatorcontrib><creatorcontrib>OKLE, Philipp</creatorcontrib><creatorcontrib>LOHWASSER, Wolfgang</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHRISTOPHERSON, Roy</au><au>ETTRIDGE, Peter</au><au>OKLE, Philipp</au><au>LOHWASSER, Wolfgang</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Estructura de película de barrera multicapa termoestable</title><date>2023-10-06</date><risdate>2023</risdate><abstract>Una película de barrera duradera que incluye una capa de sustrato polimérica que tiene un espesor entre 10 y 100 µm, una capa de recubrimiento inorgánica y una capa amortiguadora polimérica situada entre la capa de sustrato polimérica y la capa de recubrimiento inorgánica, la capa amortiguadora polimérica en contacto directo con la capa de recubrimiento inorgánica, en donde la capa de recubrimiento inorgánica comprende una estructura de onda caracterizada por una amplitud promedio entre 0,25 y 1,0 µm y una longitud de onda entre 2 y 5 µm.
This disclosure concerns a barrier packaging film including a polyolefin substrate layer having a thickness in the range of from 10 μm to 100 μm, an inorganic coating layer, and a polymeric buffer layer positioned between the polyolefin substrate and the inorganic coating layer, the polymeric buffer layer in direct contact with the inorganic coating layer, wherein the inorganic coating layer comprises a wave structure characterized by an average amplitude in the range of from 0.25 μm to 1.0 μm and a wavelength in the range of from 2 μm to 5 μm. Also disclosed are packages (e.g., hermetically sealed packages) formed from the barrier packaging film.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | Estructura de película de barrera multicapa termoestable |
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