CH606501
1421320 Electrolytic plating and anodizing of heating coils SIEMENS AG 21 June 1974 [26 July 1973] 27789/74 Heading C7B [Also in Division H5] An h.f. heating coil is electrolytically Al plated followed by anodizing and sealing the anodized layer. The coil may be pre-treated by: (i) pressureblasting...
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creator | KLAUS STOEGER RICHARD DOETZER |
description | 1421320 Electrolytic plating and anodizing of heating coils SIEMENS AG 21 June 1974 [26 July 1973] 27789/74 Heading C7B [Also in Division H5] An h.f. heating coil is electrolytically Al plated followed by anodizing and sealing the anodized layer. The coil may be pre-treated by: (i) pressureblasting with hard particles suspended in an inert gas or anhydrous aprotic liquid, (2) liquid drop bombardment with an inert anhydrous aprotic liquid or (3) by anodic removal of a thin surface layer in an 02-free, H 2 -free anhydrous aprotic organometallic bath, all as particulary described in Specification 1365009. The bath used in step (3) may be that used for Al plating and may contain AlEt 3 or AlMe3, plating being effected by polarity reversal. Other specified Al electrolytes are NaAlEt4, NaAlMe 4 , (alkyl) 4 N.AlEt 4 , Na/K.AlEt 4 , KF.2AlEt 3 , NaF.2À2AlEt 3 , (Me 3 C 6 H 5 CH 2 ) NCl.2À2AlEt 3 and Et 4 NCl.2À3AlEt 3 which may be used with up to 5 moles of a solvent such as toluene, benzene, xylene, THF, dipropyl or dibutyl ether or dioxanes. Plating may be effected under an N 2 or Ar blanket using pulsed current with a polarity reversal frequency of 10-200 c/s. Anodizing may be in a conventional H 2 SO 4 or oxalic bath followed by sealing in boiling water or steam. The coil may be a single or multiple spiral made of Cu, Al, brass or Ag (the latter being optionally a coating on Cu or brass) and is useful in zone-drawing semi-conductors. |
format | Patent |
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The coil may be pre-treated by: (i) pressureblasting with hard particles suspended in an inert gas or anhydrous aprotic liquid, (2) liquid drop bombardment with an inert anhydrous aprotic liquid or (3) by anodic removal of a thin surface layer in an 02-free, H 2 -free anhydrous aprotic organometallic bath, all as particulary described in Specification 1365009. The bath used in step (3) may be that used for Al plating and may contain AlEt 3 or AlMe3, plating being effected by polarity reversal. Other specified Al electrolytes are NaAlEt4, NaAlMe 4 , (alkyl) 4 N.AlEt 4 , Na/K.AlEt 4 , KF.2AlEt 3 , NaF.2À2AlEt 3 , (Me 3 C 6 H 5 CH 2 ) NCl.2À2AlEt 3 and Et 4 NCl.2À3AlEt 3 which may be used with up to 5 moles of a solvent such as toluene, benzene, xylene, THF, dipropyl or dibutyl ether or dioxanes. Plating may be effected under an N 2 or Ar blanket using pulsed current with a polarity reversal frequency of 10-200 c/s. Anodizing may be in a conventional H 2 SO 4 or oxalic bath followed by sealing in boiling water or steam. The coil may be a single or multiple spiral made of Cu, Al, brass or Ag (the latter being optionally a coating on Cu or brass) and is useful in zone-drawing semi-conductors.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1978</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19781031&DB=EPODOC&CC=CH&NR=606501A5$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19781031&DB=EPODOC&CC=CH&NR=606501A5$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KLAUS STOEGER</creatorcontrib><creatorcontrib>RICHARD DOETZER</creatorcontrib><title>CH606501</title><description>1421320 Electrolytic plating and anodizing of heating coils SIEMENS AG 21 June 1974 [26 July 1973] 27789/74 Heading C7B [Also in Division H5] An h.f. heating coil is electrolytically Al plated followed by anodizing and sealing the anodized layer. The coil may be pre-treated by: (i) pressureblasting with hard particles suspended in an inert gas or anhydrous aprotic liquid, (2) liquid drop bombardment with an inert anhydrous aprotic liquid or (3) by anodic removal of a thin surface layer in an 02-free, H 2 -free anhydrous aprotic organometallic bath, all as particulary described in Specification 1365009. The bath used in step (3) may be that used for Al plating and may contain AlEt 3 or AlMe3, plating being effected by polarity reversal. Other specified Al electrolytes are NaAlEt4, NaAlMe 4 , (alkyl) 4 N.AlEt 4 , Na/K.AlEt 4 , KF.2AlEt 3 , NaF.2À2AlEt 3 , (Me 3 C 6 H 5 CH 2 ) NCl.2À2AlEt 3 and Et 4 NCl.2À3AlEt 3 which may be used with up to 5 moles of a solvent such as toluene, benzene, xylene, THF, dipropyl or dibutyl ether or dioxanes. Plating may be effected under an N 2 or Ar blanket using pulsed current with a polarity reversal frequency of 10-200 c/s. Anodizing may be in a conventional H 2 SO 4 or oxalic bath followed by sealing in boiling water or steam. The coil may be a single or multiple spiral made of Cu, Al, brass or Ag (the latter being optionally a coating on Cu or brass) and is useful in zone-drawing semi-conductors.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1978</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOBw9jAzMDM1MORhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfEw5Y6mxoRVAACGABnK</recordid><startdate>19781031</startdate><enddate>19781031</enddate><creator>KLAUS STOEGER</creator><creator>RICHARD DOETZER</creator><scope>EVB</scope></search><sort><creationdate>19781031</creationdate><title>CH606501</title><author>KLAUS STOEGER ; RICHARD DOETZER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CH606501A53</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1978</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>KLAUS STOEGER</creatorcontrib><creatorcontrib>RICHARD DOETZER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KLAUS STOEGER</au><au>RICHARD DOETZER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CH606501</title><date>1978-10-31</date><risdate>1978</risdate><abstract>1421320 Electrolytic plating and anodizing of heating coils SIEMENS AG 21 June 1974 [26 July 1973] 27789/74 Heading C7B [Also in Division H5] An h.f. heating coil is electrolytically Al plated followed by anodizing and sealing the anodized layer. The coil may be pre-treated by: (i) pressureblasting with hard particles suspended in an inert gas or anhydrous aprotic liquid, (2) liquid drop bombardment with an inert anhydrous aprotic liquid or (3) by anodic removal of a thin surface layer in an 02-free, H 2 -free anhydrous aprotic organometallic bath, all as particulary described in Specification 1365009. The bath used in step (3) may be that used for Al plating and may contain AlEt 3 or AlMe3, plating being effected by polarity reversal. Other specified Al electrolytes are NaAlEt4, NaAlMe 4 , (alkyl) 4 N.AlEt 4 , Na/K.AlEt 4 , KF.2AlEt 3 , NaF.2À2AlEt 3 , (Me 3 C 6 H 5 CH 2 ) NCl.2À2AlEt 3 and Et 4 NCl.2À3AlEt 3 which may be used with up to 5 moles of a solvent such as toluene, benzene, xylene, THF, dipropyl or dibutyl ether or dioxanes. Plating may be effected under an N 2 or Ar blanket using pulsed current with a polarity reversal frequency of 10-200 c/s. Anodizing may be in a conventional H 2 SO 4 or oxalic bath followed by sealing in boiling water or steam. The coil may be a single or multiple spiral made of Cu, Al, brass or Ag (the latter being optionally a coating on Cu or brass) and is useful in zone-drawing semi-conductors.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS THEREFOR CHEMISTRY ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
title | CH606501 |
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