ELECTROPLATING SHIELD DEVICE
An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a c...
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| creator | PIASCIK, JAMES WIGGINS, CHRISTIAN MINTZER, JOSEPH W |
| description | An electroplating shield device, methods of fabricating the same, and methods of electroplating with the electroplating shield device are disclosed herein. The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1:1 to approximately 1:18. |
| format | Patent |
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The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. 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The method of electroplating includes positioning an object in an electroplating shield device. The electroplating shield device may include a conduit configured to receive the object and a plurality of openings selectively extended between inner and outer surfaces of the conduit. The openings may be positioned between first and second ends of the conduit. The method may also include forming a layer on the object by transferring fluid through the plurality of openings to at least one of a first continuous section of the object comprising a minor of the object and a second continuous section of the object comprising a major of the object. A ratio of a thickness of the major to the minor after forming the layer may range from approximately 1:1 to approximately 1:18.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | ELECTROPLATING SHIELD DEVICE |
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