THERMAL BARRIER
The present disclosure describes methods of forming thermal barriers or breaks in tubular structures configured for inclusion in a variety of construction products and building features, such as doors and windows. Methods involve using one or more connector members to couple complementary extrusion...
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Format: | Patent |
Sprache: | eng ; fre |
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Zusammenfassung: | The present disclosure describes methods of forming thermal barriers or breaks in tubular structures configured for inclusion in a variety of construction products and building features, such as doors and windows. Methods involve using one or more connector members to couple complementary extrusion profiles, which may comprise aluminum or other conductive materials. A low-conductivity material may then be deposited directly over the connector members coupling the extrusion profiles to form thermal barriers therebetween. At least a portion of the extrusion profiles may be knurled to improve the bond strength between the low-conductivity material, which may comprise polyurethane, and the extrusion profiles. Specialized components may be unnecessary to form the thermal barriers, such that the same connector members used to couple the extrusion profiles may be used to form the thermal barriers. |
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