USE OF BONDING RESIN

The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution wi...

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Hauptverfasser: NASLI BAKIR, BEN, ZAFAR, ASHAR, EKSTROM, JESPER
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creator NASLI BAKIR, BEN
ZAFAR, ASHAR
EKSTROM, JESPER
description The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin. La présente invention concerne l'utilisation d'une résine adhésive, préparée par utilisation d'une solution aqueuse comportant au moins un produit bio-sourcé, choisi parmi le tanin, l'amidon, la protéine de soja, le glycérol, la chitine, la pectine, le dextrose ou d'autres hydrates de carbone, ou un mélange de ces derniers, et par mélange de la solution aqueuse avec un ou plusieurs de certains agents de réticulation tels que des éthers, et, éventuellement, un ou plusieurs additifs. La résine adhésive est utilisée pour la fabrication de stratifiés, d'isolations à base de laine minérale ou de produits à base de bois, tels que les produits de bois d'ingénierie, tels que le contreplaqué, les panneaux à copeaux orientés (OSB), le bois de placage stratifié (LVL), les panneaux de fibres de densité moyenne (MDF), les panneaux de fibres de densité élevée (HDF) ou les panneaux de particules. De préférence, la résine adhésive ne comporte pas de lignine.
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subjects ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUTORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTINGOF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NAILING OR STAPLING MACHINES IN GENERAL
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL
title USE OF BONDING RESIN
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