METHODS AND SYSTEMS FOR MANUFACTURING FOAM WALL STRUCTURES

Methods for manufacturing foam wall structures are described. The methods include placing a wall structure proximate to a robotic arm, orienting an imaging device so that the imaging device on the robotic arm faces a cavity in the wall structure, surveying the cavity using the imaging device, determ...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LAMBACH, JAMES L, PALMOSINA, MICHAEL F, CLOHERTY, SCOTT M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING METALLURGY NOZZLES ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Methods for manufacturing foam wall structures are described. The methods include placing a wall structure proximate to a robotic arm, orienting an imaging device so that the imaging device on the robotic arm faces a cavity in the wall structure, surveying the cavity using the imaging device, determining a spray foaming pattern to fill the cavity to a selected depth with a foam layer, orienting the spray nozzle so the spray nozzle faces the cavity, and spray-applying the foam-forming composition into the cavity to the selected depth by passing the foam-forming composition through the spray nozzle to form the foam layer. Foam wall structure manufacturing systems that are suitable for carrying out such methods are also described.