RESIN COMPONENT, AND MOLDING METHOD AND MOLDING DEVICE FOR SAME

An instrument panel 10 is obtained by bonding a base material part 20 made from a base material M1 and a different material part 30 made from a different material M2. The different material part 30 is inserted into the base material 20, and this insertion part 33 has a plurality of discontinuous rec...

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Bibliographische Detailangaben
Hauptverfasser: HIRANO, NOBORU, KAWANO, KAZUHIRO, KAMI, YUUKI, MORIIZUMI, TAIKI, YUSA, ATSUSHI, SAIMURA, TOSHIHIRO, MIYAMOTO, HAJIME
Format: Patent
Sprache:eng ; fre
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