MULTILAYER STACK WITH ENHANCED CONDUCTIVITY AND STABILTIY
An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respec...
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| creator | BRUTON, ERIC ALAN KINLEN, PATRICK JOHN FLACK, MATTHEW |
| description | An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Un procédé servant dexemple consiste à : (i) déposer une couche isolante sur un substrat; (ii) former une couche de polymère conducteur sur la couche isolante; et (iii) répéter le dépôt dune couche isolante respectivement et la formation dune couche de polymère conducteur respective pour former un empilement multicouche de couches de polymère conducteur interposées entre des couches isolantes respectives. Chaque couche de polymère conducteur respective a une résistance respective, de sorte que, lorsque les couches de polymère conducteur sont raccordées en parallèle à une source d'alimentation, une résistance résultante des couches de polymère conducteur respectives est inférieure à chaque résistance respective. |
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Un procédé servant dexemple consiste à : (i) déposer une couche isolante sur un substrat; (ii) former une couche de polymère conducteur sur la couche isolante; et (iii) répéter le dépôt dune couche isolante respectivement et la formation dune couche de polymère conducteur respective pour former un empilement multicouche de couches de polymère conducteur interposées entre des couches isolantes respectives. Chaque couche de polymère conducteur respective a une résistance respective, de sorte que, lorsque les couches de polymère conducteur sont raccordées en parallèle à une source d'alimentation, une résistance résultante des couches de polymère conducteur respectives est inférieure à chaque résistance respective.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INSULATORS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230905&DB=EPODOC&CC=CA&NR=3027652C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230905&DB=EPODOC&CC=CA&NR=3027652C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BRUTON, ERIC ALAN</creatorcontrib><creatorcontrib>KINLEN, PATRICK JOHN</creatorcontrib><creatorcontrib>FLACK, MATTHEW</creatorcontrib><title>MULTILAYER STACK WITH ENHANCED CONDUCTIVITY AND STABILTIY</title><description>An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Un procédé servant dexemple consiste à : (i) déposer une couche isolante sur un substrat; (ii) former une couche de polymère conducteur sur la couche isolante; et (iii) répéter le dépôt dune couche isolante respectivement et la formation dune couche de polymère conducteur respective pour former un empilement multicouche de couches de polymère conducteur interposées entre des couches isolantes respectives. Chaque couche de polymère conducteur respective a une résistance respective, de sorte que, lorsque les couches de polymère conducteur sont raccordées en parallèle à une source d'alimentation, une résistance résultante des couches de polymère conducteur respectives est inférieure à chaque résistance respective.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD0DfUJ8fRxjHQNUggOcXT2Vgj3DPFQcPXzcPRzdnVRcPb3cwl1DvEM8wyJVHD0cwEpcvIEaonkYWBNS8wpTuWF0twM8m6uIc4euqkF-fGpxQWJyal5qSXxzo7GBkbmZqZGzsaEVQAACmcoFQ</recordid><startdate>20230905</startdate><enddate>20230905</enddate><creator>BRUTON, ERIC ALAN</creator><creator>KINLEN, PATRICK JOHN</creator><creator>FLACK, MATTHEW</creator><scope>EVB</scope></search><sort><creationdate>20230905</creationdate><title>MULTILAYER STACK WITH ENHANCED CONDUCTIVITY AND STABILTIY</title><author>BRUTON, ERIC ALAN ; KINLEN, PATRICK JOHN ; FLACK, MATTHEW</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA3027652C3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>BRUTON, ERIC ALAN</creatorcontrib><creatorcontrib>KINLEN, PATRICK JOHN</creatorcontrib><creatorcontrib>FLACK, MATTHEW</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BRUTON, ERIC ALAN</au><au>KINLEN, PATRICK JOHN</au><au>FLACK, MATTHEW</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER STACK WITH ENHANCED CONDUCTIVITY AND STABILTIY</title><date>2023-09-05</date><risdate>2023</risdate><abstract>An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.
Un procédé servant dexemple consiste à : (i) déposer une couche isolante sur un substrat; (ii) former une couche de polymère conducteur sur la couche isolante; et (iii) répéter le dépôt dune couche isolante respectivement et la formation dune couche de polymère conducteur respective pour former un empilement multicouche de couches de polymère conducteur interposées entre des couches isolantes respectives. Chaque couche de polymère conducteur respective a une résistance respective, de sorte que, lorsque les couches de polymère conducteur sont raccordées en parallèle à une source d'alimentation, une résistance résultante des couches de polymère conducteur respectives est inférieure à chaque résistance respective.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING |
| title | MULTILAYER STACK WITH ENHANCED CONDUCTIVITY AND STABILTIY |
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