SOLVENT CEMENT FORMULATIONS
Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic...
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| creator | PARHAR, AMRIT PEREZ, WILLIE |
| description | Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
L'invention concerne des formulations d'adhésifs à solvants organiques comprenant du tétrahydrofurane, de la cyclohexanone, de la méthyléthylcétone, de l'acétone, une résine thermoplastique, de la silice, et/ou un agent épaississant associé à un copolymère acrylique soluble dans un solvant. Ces formulations contiennent un complément réduit de composés organiques volatils (COV) par rapport aux formulations d'adhésifs classiques, mais sont susceptibles de satisfaire aux exigences d'applications classiques, moyennes et lourdes. L'utilisation des constituants de l'agent épaississant associé spécialisé confère un degré requis de viscosité tout en permettant une réduction de la concentration en COV, tels que le tétrahydrofurane. |
| format | Patent |
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L'invention concerne des formulations d'adhésifs à solvants organiques comprenant du tétrahydrofurane, de la cyclohexanone, de la méthyléthylcétone, de l'acétone, une résine thermoplastique, de la silice, et/ou un agent épaississant associé à un copolymère acrylique soluble dans un solvant. Ces formulations contiennent un complément réduit de composés organiques volatils (COV) par rapport aux formulations d'adhésifs classiques, mais sont susceptibles de satisfaire aux exigences d'applications classiques, moyennes et lourdes. L'utilisation des constituants de l'agent épaississant associé spécialisé confère un degré requis de viscosité tout en permettant une réduction de la concentration en COV, tels que le tétrahydrofurane.</description><language>eng ; fre</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240402&DB=EPODOC&CC=CA&NR=3013461C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240402&DB=EPODOC&CC=CA&NR=3013461C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PARHAR, AMRIT</creatorcontrib><creatorcontrib>PEREZ, WILLIE</creatorcontrib><title>SOLVENT CEMENT FORMULATIONS</title><description>Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
L'invention concerne des formulations d'adhésifs à solvants organiques comprenant du tétrahydrofurane, de la cyclohexanone, de la méthyléthylcétone, de l'acétone, une résine thermoplastique, de la silice, et/ou un agent épaississant associé à un copolymère acrylique soluble dans un solvant. Ces formulations contiennent un complément réduit de composés organiques volatils (COV) par rapport aux formulations d'adhésifs classiques, mais sont susceptibles de satisfaire aux exigences d'applications classiques, moyennes et lourdes. L'utilisation des constituants de l'agent épaississant associé spécialisé confère un degré requis de viscosité tout en permettant une réduction de la concentration en COV, tels que le tétrahydrofurane.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAO9vcJc_ULUXB29QVRbv5BvqE-jiGe_n7BPAysaYk5xam8UJqbQd7NNcTZQze1ID8-tbggMTk1L7Uk3tnR2MDQ2MTM0NmYsAoA7YQf1g</recordid><startdate>20240402</startdate><enddate>20240402</enddate><creator>PARHAR, AMRIT</creator><creator>PEREZ, WILLIE</creator><scope>EVB</scope></search><sort><creationdate>20240402</creationdate><title>SOLVENT CEMENT FORMULATIONS</title><author>PARHAR, AMRIT ; PEREZ, WILLIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA3013461C3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>PARHAR, AMRIT</creatorcontrib><creatorcontrib>PEREZ, WILLIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PARHAR, AMRIT</au><au>PEREZ, WILLIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SOLVENT CEMENT FORMULATIONS</title><date>2024-04-02</date><risdate>2024</risdate><abstract>Provided are solvent cement formulations comprising some or all of tetrahydrofuran, cyclohexanone, methyl ethyl ketone, acetone, a thermoplastic resin, silica, and, a solvent soluble acrylic copolymer associative thickener. The disclosed formulations contain a reduced complement of volatile organic compounds (VOCs) relative to conventional cement formulations, yet are capable of meeting the requirements for regular-, medium-, and heavy-duty applications. The use of specialized associative thickener components confers a required degree of viscosity while enabling a reduction in the concentration of VOCs, such as tetrahydrofuran.
L'invention concerne des formulations d'adhésifs à solvants organiques comprenant du tétrahydrofurane, de la cyclohexanone, de la méthyléthylcétone, de l'acétone, une résine thermoplastique, de la silice, et/ou un agent épaississant associé à un copolymère acrylique soluble dans un solvant. Ces formulations contiennent un complément réduit de composés organiques volatils (COV) par rapport aux formulations d'adhésifs classiques, mais sont susceptibles de satisfaire aux exigences d'applications classiques, moyennes et lourdes. L'utilisation des constituants de l'agent épaississant associé spécialisé confère un degré requis de viscosité tout en permettant une réduction de la concentration en COV, tels que le tétrahydrofurane.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
| title | SOLVENT CEMENT FORMULATIONS |
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