HIGH TEMPERATURE, HIGH VOLTAGE SIC VOID-LESS ELECTRONIC PACKAGE

An electronic package designed to package silicon carbide discrete components for silicon carbide chips. The electronic package allows thousands of power cycles and/or temperature cycles between -550°C to 3000°C. The present invention can also tolerate continuous operation at 3000°C, due to high the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AUTRY, TRACY, KELLY, STEPHEN G
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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