THERMOPLASTIC MOLDING MATERIALS BASED ON POLYESTERS AND STYRENE COPOLYMERS
Thermoplastic molding materials, comprising A) 10 to 97.5 % by weight of at least one thermoplastic polyester A; B) 1 to 97.5 % by weight of at least one graft polymer B from b1) 40 to 80 % by weight of a graft base from a rubber-elastic polymer B1 on the basis of alkylacrylates with 1 to 8 C atoms...
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Zusammenfassung: | Thermoplastic molding materials, comprising A) 10 to 97.5 % by weight of at least one thermoplastic polyester A; B) 1 to 97.5 % by weight of at least one graft polymer B from b1) 40 to 80 % by weight of a graft base from a rubber-elastic polymer B1 on the basis of alkylacrylates with 1 to 8 C atoms in the alkyl group, ethylene/propylene, dienes or siloxanes and having a glass transition temperature of below 0 ~C, b2) 20 to 60 % by weight of a graft base B2 from b21) 60 to 95 % by weight of styrene or substituted styrenes B21 of general formula (I), wherein R represents a C1-8 alkyl group or hydrogen and R1 represents a C1-8 alkyl group and n is 1, 2 or 3, or the mixtures thereof and b22) 5 to 40 % by weight of at least one unsaturated nitrile B22; C) 1 to 97.5 % by weight of at least one thermoplastic copolymer C, from c1) 60 to 85 % by weight of styrene or substituted styrenes C1 of general formula (I) or the mixtures thereof and c2) 15 to 40 % by weight of at least one unsaturated nitrile C2; D) 0.5 to 50 % by weight of at least one copolymer D, which is obtainable by reacting d1) 5 to 95 % by weight of at least one thermoplastic methacrylate polymer D1 comprising at least one kind of functional groups, selected from the group including epoxy, carboxyl, hydroxyl, anhydride and oxazoline, with d2) 5 to 95 % by weight of at least one thermoplastic polyester D2; E) 0 to 40 % by weight of at least one filler E; F) 0 to 2 % by weight of at least one organic acid F; G) 0 to 25 % by weight of at least one halogen-free phosphorus compound G; H) 0 to 45 % by weight of other additives H; the sum of components A to H always adding up to 100 %. |
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