SEMICONDUCTOR SUBSTRATE HAVING COPPER/DIAMOND COMPOSITE MATERIAL AND METHOD OF MAKING SAME

A semiconductor package for power transistors of the LDMOS type has a metallic substrate with a die mounted directly thereon, lead frame insulators mounted thereon adjacent the die and a plurality of leads mounted on the insulators and electrically coupled to the die by bond wires. The substrate inc...

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Bibliographische Detailangaben

1. Verfasser:	MCCOY, JOHN WASHINGTON
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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