METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD
To allow a reliable and inexpensive, preferably hermetic join to be produced between metal sleeve and glass pane in a process for producing a housing body, or at least parts of a housing body, in particular for producing an encapsulation or packaging for optoelectronic components, comprising the ste...
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| creator | HAMMER, BERND SCHACHTELBAUER, KLAUS HETTLER, ROBERT MUND, DIETRICH MAYER, MARKUS SAUSENTHALER, EDELTRAUD |
| description | To allow a reliable and inexpensive, preferably hermetic join to be produced between metal sleeve and glass pane in a process for producing a housing body, or at least parts of a housing body, in particular for producing an encapsulation or packaging for optoelectronic components, comprising the steps of joining together a housing element and a preferably metallic housing arrangement, bringing housing element and housing arrangement into contact with a glass solder, it is provided that before the housing element and housing arrangement are joined, the glass solder is applied as a shapeable material, in particular as a paste, that the glass solder is pre-vitrified and its shape fixed by energy being introduced at least once, in particular as a result of organic constituents being burnt off, and that after the housing element has been inserted into the housing arrangement, a join which is hermetic at least in regions is produced between pane and housing arrangement.
La présente invention concerne un procédé pour réaliser un corps de boîtier ou au moins des parties d'un corps de boîtier, notamment pour réaliser un enrobage de composants optoélectroniques. Ledit procédé comprend l'assemblage d'un élément de boîtier et d'une structure de boîtier de préférence métallique et la mise en contact de l'élément de boîtier et de la structure de boîtier avec une brasure de verre. L'invention a pour objet de permettre la formation d'une liaison de préférence hermétique, fiable et économique entre gaine métallique et plaque de verre. A cet effet: la brasure de verre est appliquée en tant que masse déformable, notamment en tant que pâte, avant l'assemblage de l'élément de boîtier et de la structure de boîtier; au moins un simple apport d'énergie, notamment la combustion de composants organiques, sert à vitrifier la brasure de verre et à établir sa forme définitive; et, après mise en place de l'élément de boîtier dans la structure de boîtier, un chauffage permet la formation d'une liaison hermétique au moins par zone entre la plaque de verre et la structure de boîtier. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CA2485498C</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CA2485498C</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CA2485498C3</originalsourceid><addsrcrecordid>eNrjZMj2dQ3x8HdRcPMPUvBwDQLyPJ0dfXwiFTz8Q4M9_dwV_APAIgrO_r4B_n6ufiHBCo5-LtiEA4L8XUKdXV0UHJ2d_YNcQJpD_BWCHT1dFCCW8DCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeGdHIxMLUxNLC2djwioAD901zA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD</title><source>esp@cenet</source><creator>HAMMER, BERND ; SCHACHTELBAUER, KLAUS ; HETTLER, ROBERT ; MUND, DIETRICH ; MAYER, MARKUS ; SAUSENTHALER, EDELTRAUD</creator><creatorcontrib>HAMMER, BERND ; SCHACHTELBAUER, KLAUS ; HETTLER, ROBERT ; MUND, DIETRICH ; MAYER, MARKUS ; SAUSENTHALER, EDELTRAUD</creatorcontrib><description>To allow a reliable and inexpensive, preferably hermetic join to be produced between metal sleeve and glass pane in a process for producing a housing body, or at least parts of a housing body, in particular for producing an encapsulation or packaging for optoelectronic components, comprising the steps of joining together a housing element and a preferably metallic housing arrangement, bringing housing element and housing arrangement into contact with a glass solder, it is provided that before the housing element and housing arrangement are joined, the glass solder is applied as a shapeable material, in particular as a paste, that the glass solder is pre-vitrified and its shape fixed by energy being introduced at least once, in particular as a result of organic constituents being burnt off, and that after the housing element has been inserted into the housing arrangement, a join which is hermetic at least in regions is produced between pane and housing arrangement.
La présente invention concerne un procédé pour réaliser un corps de boîtier ou au moins des parties d'un corps de boîtier, notamment pour réaliser un enrobage de composants optoélectroniques. Ledit procédé comprend l'assemblage d'un élément de boîtier et d'une structure de boîtier de préférence métallique et la mise en contact de l'élément de boîtier et de la structure de boîtier avec une brasure de verre. L'invention a pour objet de permettre la formation d'une liaison de préférence hermétique, fiable et économique entre gaine métallique et plaque de verre. A cet effet: la brasure de verre est appliquée en tant que masse déformable, notamment en tant que pâte, avant l'assemblage de l'élément de boîtier et de la structure de boîtier; au moins un simple apport d'énergie, notamment la combustion de composants organiques, sert à vitrifier la brasure de verre et à établir sa forme définitive; et, après mise en place de l'élément de boîtier dans la structure de boîtier, un chauffage permet la formation d'une liaison hermétique au moins par zone entre la plaque de verre et la structure de boîtier.</description><language>eng ; fre</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; DEVICES USING STIMULATED EMISSION ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MINERAL OR SLAG WOOL ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; PRINTED CIRCUITS ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120529&DB=EPODOC&CC=CA&NR=2485498C$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120529&DB=EPODOC&CC=CA&NR=2485498C$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAMMER, BERND</creatorcontrib><creatorcontrib>SCHACHTELBAUER, KLAUS</creatorcontrib><creatorcontrib>HETTLER, ROBERT</creatorcontrib><creatorcontrib>MUND, DIETRICH</creatorcontrib><creatorcontrib>MAYER, MARKUS</creatorcontrib><creatorcontrib>SAUSENTHALER, EDELTRAUD</creatorcontrib><title>METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD</title><description>To allow a reliable and inexpensive, preferably hermetic join to be produced between metal sleeve and glass pane in a process for producing a housing body, or at least parts of a housing body, in particular for producing an encapsulation or packaging for optoelectronic components, comprising the steps of joining together a housing element and a preferably metallic housing arrangement, bringing housing element and housing arrangement into contact with a glass solder, it is provided that before the housing element and housing arrangement are joined, the glass solder is applied as a shapeable material, in particular as a paste, that the glass solder is pre-vitrified and its shape fixed by energy being introduced at least once, in particular as a result of organic constituents being burnt off, and that after the housing element has been inserted into the housing arrangement, a join which is hermetic at least in regions is produced between pane and housing arrangement.
La présente invention concerne un procédé pour réaliser un corps de boîtier ou au moins des parties d'un corps de boîtier, notamment pour réaliser un enrobage de composants optoélectroniques. Ledit procédé comprend l'assemblage d'un élément de boîtier et d'une structure de boîtier de préférence métallique et la mise en contact de l'élément de boîtier et de la structure de boîtier avec une brasure de verre. L'invention a pour objet de permettre la formation d'une liaison de préférence hermétique, fiable et économique entre gaine métallique et plaque de verre. A cet effet: la brasure de verre est appliquée en tant que masse déformable, notamment en tant que pâte, avant l'assemblage de l'élément de boîtier et de la structure de boîtier; au moins un simple apport d'énergie, notamment la combustion de composants organiques, sert à vitrifier la brasure de verre et à établir sa forme définitive; et, après mise en place de l'élément de boîtier dans la structure de boîtier, un chauffage permet la formation d'une liaison hermétique au moins par zone entre la plaque de verre et la structure de boîtier.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMj2dQ3x8HdRcPMPUvBwDQLyPJ0dfXwiFTz8Q4M9_dwV_APAIgrO_r4B_n6ufiHBCo5-LtiEA4L8XUKdXV0UHJ2d_YNcQJpD_BWCHT1dFCCW8DCwpiXmFKfyQmluBnk31xBnD93Ugvz41OKCxOTUvNSSeGdHIxMLUxNLC2djwioAD901zA</recordid><startdate>20120529</startdate><enddate>20120529</enddate><creator>HAMMER, BERND</creator><creator>SCHACHTELBAUER, KLAUS</creator><creator>HETTLER, ROBERT</creator><creator>MUND, DIETRICH</creator><creator>MAYER, MARKUS</creator><creator>SAUSENTHALER, EDELTRAUD</creator><scope>EVB</scope></search><sort><creationdate>20120529</creationdate><title>METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD</title><author>HAMMER, BERND ; SCHACHTELBAUER, KLAUS ; HETTLER, ROBERT ; MUND, DIETRICH ; MAYER, MARKUS ; SAUSENTHALER, EDELTRAUD</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CA2485498C3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre</language><creationdate>2012</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><toplevel>online_resources</toplevel><creatorcontrib>HAMMER, BERND</creatorcontrib><creatorcontrib>SCHACHTELBAUER, KLAUS</creatorcontrib><creatorcontrib>HETTLER, ROBERT</creatorcontrib><creatorcontrib>MUND, DIETRICH</creatorcontrib><creatorcontrib>MAYER, MARKUS</creatorcontrib><creatorcontrib>SAUSENTHALER, EDELTRAUD</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAMMER, BERND</au><au>SCHACHTELBAUER, KLAUS</au><au>HETTLER, ROBERT</au><au>MUND, DIETRICH</au><au>MAYER, MARKUS</au><au>SAUSENTHALER, EDELTRAUD</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD</title><date>2012-05-29</date><risdate>2012</risdate><abstract>To allow a reliable and inexpensive, preferably hermetic join to be produced between metal sleeve and glass pane in a process for producing a housing body, or at least parts of a housing body, in particular for producing an encapsulation or packaging for optoelectronic components, comprising the steps of joining together a housing element and a preferably metallic housing arrangement, bringing housing element and housing arrangement into contact with a glass solder, it is provided that before the housing element and housing arrangement are joined, the glass solder is applied as a shapeable material, in particular as a paste, that the glass solder is pre-vitrified and its shape fixed by energy being introduced at least once, in particular as a result of organic constituents being burnt off, and that after the housing element has been inserted into the housing arrangement, a join which is hermetic at least in regions is produced between pane and housing arrangement.
La présente invention concerne un procédé pour réaliser un corps de boîtier ou au moins des parties d'un corps de boîtier, notamment pour réaliser un enrobage de composants optoélectroniques. Ledit procédé comprend l'assemblage d'un élément de boîtier et d'une structure de boîtier de préférence métallique et la mise en contact de l'élément de boîtier et de la structure de boîtier avec une brasure de verre. L'invention a pour objet de permettre la formation d'une liaison de préférence hermétique, fiable et économique entre gaine métallique et plaque de verre. A cet effet: la brasure de verre est appliquée en tant que masse déformable, notamment en tant que pâte, avant l'assemblage de l'élément de boîtier et de la structure de boîtier; au moins un simple apport d'énergie, notamment la combustion de composants organiques, sert à vitrifier la brasure de verre et à établir sa forme définitive; et, après mise en place de l'élément de boîtier dans la structure de boîtier, un chauffage permet la formation d'une liaison hermétique au moins par zone entre la plaque de verre et la structure de boîtier.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY DEVICES USING STIMULATED EMISSION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MINERAL OR SLAG WOOL OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS |
| title | METHOD FOR HERMETICALLY HOUSING OPTICAL COMPONENTS AND OPTICAL COMPONENTS PRODUCED ACCORDING TO SAID METHOD |
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