POLYAMIDEIMIDE RESIN SOLUTION AND ITS USE TO PREPARE WIRE ENAMELS
The invention relates to a polyamide-imide resin solution that is obtained b y reacting (a) aromatic polycarboxylic acids and/or the anhydrides thereof wit h (b) aromatic imide- and amide-forming components in cresol at temperatures above 170 ~C. The invention further relates to the use of said poly...
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| creator | TODTER-KONIG, SASCHA LIENERT, KLAUS-WILHELM SCHMIDT, GEROLD |
| description | The invention relates to a polyamide-imide resin solution that is obtained b y reacting (a) aromatic polycarboxylic acids and/or the anhydrides thereof wit h (b) aromatic imide- and amide-forming components in cresol at temperatures above 170 ~C. The invention further relates to the use of said polyamide-imi de resin solution for producing wire enamels, to the corresponding enamels and to the wires that are coated with said enamels. |
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The invention further relates to the use of said polyamide-imi de resin solution for producing wire enamels, to the corresponding enamels and to the wires that are coated with said enamels.</description><edition>7</edition><language>eng ; fre</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CONDUCTORS ; CORRECTING FLUIDS ; DYES ; ELECTRICITY ; FILLING PASTES ; INKS ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030220&DB=EPODOC&CC=CA&NR=2420314A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20030220&DB=EPODOC&CC=CA&NR=2420314A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TODTER-KONIG, SASCHA</creatorcontrib><creatorcontrib>LIENERT, KLAUS-WILHELM</creatorcontrib><creatorcontrib>SCHMIDT, GEROLD</creatorcontrib><title>POLYAMIDEIMIDE RESIN SOLUTION AND ITS USE TO PREPARE WIRE ENAMELS</title><description>The invention relates to a polyamide-imide resin solution that is obtained b y reacting (a) aromatic polycarboxylic acids and/or the anhydrides thereof wit h (b) aromatic imide- and amide-forming components in cresol at temperatures above 170 ~C. 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The invention further relates to the use of said polyamide-imi de resin solution for producing wire enamels, to the corresponding enamels and to the wires that are coated with said enamels.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CONDUCTORS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INKS INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | POLYAMIDEIMIDE RESIN SOLUTION AND ITS USE TO PREPARE WIRE ENAMELS |
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