LAMINATE FOR THE FORMATION OF BEAM LEADS FOR IC CHIP BONDING

LAMINATE FOR THE FORMATION OF BEAM LEADS FOR IC CHIP BONDING A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises a) a flexible metal strip, b) a layer of a first resist adhered to one surface of the metal strip, and c) a layer of a...

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Bibliographische Detailangaben
Hauptverfasser:	MOLAIRE, MICHEL F, KLEIN, GERALD W, MCCONKEY, ROBERT C, NOONAN, JOHN M
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORIGINALS THEREFOR PAINTS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	LAMINATE FOR THE FORMATION OF BEAM LEADS FOR IC CHIP BONDING A laminate, adapted for manufacturing frames of metal beam leads that are bonded to integrated circuit chips, comprises a) a flexible metal strip, b) a layer of a first resist adhered to one surface of the metal strip, and c) a layer of a second resist adhered to the opposite surface of the metal strip, the second resist being a negative-working resist comprising (1) a polymeric binder, (2) a photopolymerizable monomer mixture, and (3) a photoinitiator composition. The negative-working resist exhibits excellent flexibility and adhesion to the metal and superior performance during high temperature processing, whereby it serves effectively as a support for the beam leads.