LOW CONTACT ELECTRICAL RESISTANT COMPOSITION, SUBSTRATES COATED THEREWITH, AND PROCESS FOR PREPARING SUCH

LOW CONTACT ELECTRICAL RESISTANT COMPOSITION SUBSTRATES COATED THEREWITH, AND PROCESS FOR PREPARING SUCH A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an MxG100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and m...

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Bibliographische Detailangaben
Hauptverfasser:	DIBBLE, ERIC P, LEVINE, SOLOMON L, CUOMO, JEROME J
Format:	Patent
Sprache:	eng ; fre
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS METALLURGY RELAYS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTORS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	LOW CONTACT ELECTRICAL RESISTANT COMPOSITION SUBSTRATES COATED THEREWITH, AND PROCESS FOR PREPARING SUCH A composition of a metallic compound represented by the formula MT, and G is provided by sputtering an MxG100-x target. M is a metal selected from the group of titanium, hafnium, zirconium, and mixtures thereof. T is selected from the group of N, C, and mixtures thereof. G is a metal selected from the group of gold, platinum, and palladium. X is an integer from about 65 to about 95. Also provided are substrates coated with the composition and process for depositing the composition on substrates.