MÉTODO PARA INCORPORAR MATRIZ DE SILÍCIO EXISTENTE DENTRO DE PILHA INTEGRADA DE 3D

An apparatus including a first die including a plurality of conductive through substrate vias (TSVs); and a plurality of second dice each including a plurality of contact points coupled to the TSVs of the first die, the plurality of second dice arranged to collectively include a surface area approxi...

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Bibliographische Detailangaben

Hauptverfasser:	BRYAN BLACK, PAUL REED RIEWERTS
Format:	Patent
Sprache:	por
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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