Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo

composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo. a presente divulgação refere-se geralmente a uma composição de resina tendo uma baixa constante dielétrica (dk) e um baixo fator de dissipação dielétrica (df) incluindo um reticulador selecionado a partir...

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Hauptverfasser:	KENNETH BLACK SCOBBIE, MICHAEL YIN WONG, NAPOLI ALESSANDRO, ELMER SUSANNE, STORZ CHRISTOF
Format:	Patent
Sprache:	por
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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creator	KENNETH BLACK SCOBBIE MICHAEL YIN WONG NAPOLI ALESSANDRO ELMER SUSANNE STORZ CHRISTOF
description	composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo. a presente divulgação refere-se geralmente a uma composição de resina tendo uma baixa constante dielétrica (dk) e um baixo fator de dissipação dielétrica (df) incluindo um reticulador selecionado a partir um composto de vinilbenzil indeno, um composto de vinilbenzil fluoreno e uma mistura dos mesmos e uma resina selecionada a partir de um derivado de éter de polifenileno, um termoplástico de hidrocarboneto e um composto contendo um ou mais grupos maleimida. The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_BR112023020126A2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>BR112023020126A2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_BR112023020126A23</originalsourceid><addsrcrecordid>eNqNizEKAjEQRdNYiHqHaSyFJAv2uijWYr_MZmclsNkJSQTvYyGeIxczqx7A6j8e78-Fqdl5jjY_84OhIwgU7YgTtWjvRVka8isFaxgIbg4wJHv9pD22ReP36gN5DNgxIPipCVDYUXS8FLMeh0ir3y7E-ni41KcNeW4oejQ0Umr2Z6W01JXUUuntTlf_dm8JfEJR</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo</title><source>esp@cenet</source><creator>KENNETH BLACK SCOBBIE ; MICHAEL YIN WONG ; NAPOLI ALESSANDRO ; ELMER SUSANNE ; STORZ CHRISTOF</creator><creatorcontrib>KENNETH BLACK SCOBBIE ; MICHAEL YIN WONG ; NAPOLI ALESSANDRO ; ELMER SUSANNE ; STORZ CHRISTOF</creatorcontrib><description>composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo. a presente divulgação refere-se geralmente a uma composição de resina tendo uma baixa constante dielétrica (dk) e um baixo fator de dissipação dielétrica (df) incluindo um reticulador selecionado a partir um composto de vinilbenzil indeno, um composto de vinilbenzil fluoreno e uma mistura dos mesmos e uma resina selecionada a partir de um derivado de éter de polifenileno, um termoplástico de hidrocarboneto e um composto contendo um ou mais grupos maleimida. The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.</description><language>por</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231114&DB=EPODOC&CC=BR&NR=112023020126A2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231114&DB=EPODOC&CC=BR&NR=112023020126A2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KENNETH BLACK SCOBBIE</creatorcontrib><creatorcontrib>MICHAEL YIN WONG</creatorcontrib><creatorcontrib>NAPOLI ALESSANDRO</creatorcontrib><creatorcontrib>ELMER SUSANNE</creatorcontrib><creatorcontrib>STORZ CHRISTOF</creatorcontrib><title>Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo</title><description>composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo. a presente divulgação refere-se geralmente a uma composição de resina tendo uma baixa constante dielétrica (dk) e um baixo fator de dissipação dielétrica (df) incluindo um reticulador selecionado a partir um composto de vinilbenzil indeno, um composto de vinilbenzil fluoreno e uma mistura dos mesmos e uma resina selecionada a partir de um derivado de éter de polifenileno, um termoplástico de hidrocarboneto e um composto contendo um ou mais grupos maleimida. The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNizEKAjEQRdNYiHqHaSyFJAv2uijWYr_MZmclsNkJSQTvYyGeIxczqx7A6j8e78-Fqdl5jjY_84OhIwgU7YgTtWjvRVka8isFaxgIbg4wJHv9pD22ReP36gN5DNgxIPipCVDYUXS8FLMeh0ir3y7E-ni41KcNeW4oejQ0Umr2Z6W01JXUUuntTlf_dm8JfEJR</recordid><startdate>20231114</startdate><enddate>20231114</enddate><creator>KENNETH BLACK SCOBBIE</creator><creator>MICHAEL YIN WONG</creator><creator>NAPOLI ALESSANDRO</creator><creator>ELMER SUSANNE</creator><creator>STORZ CHRISTOF</creator><scope>EVB</scope></search><sort><creationdate>20231114</creationdate><title>Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo</title><author>KENNETH BLACK SCOBBIE ; MICHAEL YIN WONG ; NAPOLI ALESSANDRO ; ELMER SUSANNE ; STORZ CHRISTOF</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_BR112023020126A23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>por</language><creationdate>2023</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KENNETH BLACK SCOBBIE</creatorcontrib><creatorcontrib>MICHAEL YIN WONG</creatorcontrib><creatorcontrib>NAPOLI ALESSANDRO</creatorcontrib><creatorcontrib>ELMER SUSANNE</creatorcontrib><creatorcontrib>STORZ CHRISTOF</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KENNETH BLACK SCOBBIE</au><au>MICHAEL YIN WONG</au><au>NAPOLI ALESSANDRO</au><au>ELMER SUSANNE</au><au>STORZ CHRISTOF</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo</title><date>2023-11-14</date><risdate>2023</risdate><abstract>composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo. a presente divulgação refere-se geralmente a uma composição de resina tendo uma baixa constante dielétrica (dk) e um baixo fator de dissipação dielétrica (df) incluindo um reticulador selecionado a partir um composto de vinilbenzil indeno, um composto de vinilbenzil fluoreno e uma mistura dos mesmos e uma resina selecionada a partir de um derivado de éter de polifenileno, um termoplástico de hidrocarboneto e um composto contendo um ou mais grupos maleimida. The present disclosure generally relates to a resin composition having a low dielectric constant (Dk) and a low dielectric dissipation factor (Df) including a crosslinker selected from a vinylbenzyl indene compound, a vinylbenzyl fluorene compound and a mixture thereof and a resin selected from a polyphenylene ether derivative, a hydrocarbon thermoplastic and a compound containing one or more maleimide groups.</abstract><oa>free_for_read</oa></addata></record>
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language	por
recordid	cdi_epo_espacenet_BR112023020126A2
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subjects	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
title	Composição de resina de baixo dielétrico e um artigo de fabricação preparado a partir do mesmo
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T00%3A58%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KENNETH%20BLACK%20SCOBBIE&rft.date=2023-11-14&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EBR112023020126A2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true