Fundente para soldar
"FUNDENTE PARA SOLDAR". Um fundente de soldagem inclui uma resina não-ácida em uma composição aquosa. O fundente também pode incluir um agente ativante e um agente tensoativo que promove umedecimento de superfície. O fundente pode ser usado para revestir circuitos e um painel de circuito i...
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| creator | ALVIN E. SCHNEIDER SANYOGITA ARORA KAREN A. TELLEFSEN |
| description | "FUNDENTE PARA SOLDAR". Um fundente de soldagem inclui uma resina não-ácida em uma composição aquosa. O fundente também pode incluir um agente ativante e um agente tensoativo que promove umedecimento de superfície. O fundente pode ser usado para revestir circuitos e um painel de circuito impresso.
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form. |
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A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.</description><edition>7</edition><language>por</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021126&DB=EPODOC&CC=BR&NR=0016118A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20021126&DB=EPODOC&CC=BR&NR=0016118A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ALVIN E. SCHNEIDER</creatorcontrib><creatorcontrib>SANYOGITA ARORA</creatorcontrib><creatorcontrib>KAREN A. TELLEFSEN</creatorcontrib><title>Fundente para soldar</title><description>"FUNDENTE PARA SOLDAR". Um fundente de soldagem inclui uma resina não-ácida em uma composição aquosa. O fundente também pode incluir um agente ativante e um agente tensoativo que promove umedecimento de superfície. O fundente pode ser usado para revestir circuitos e um painel de circuito impresso.
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBxK81LSc0rSVUoSCxKVCjOz0lJLOJhYE1LzClO5YXS3Azybq4hzh66qQX58anFBYnJqXmpJfFOQQYGhmaGhhaOxoRVAADC4x_B</recordid><startdate>20021126</startdate><enddate>20021126</enddate><creator>ALVIN E. SCHNEIDER</creator><creator>SANYOGITA ARORA</creator><creator>KAREN A. TELLEFSEN</creator><scope>EVB</scope></search><sort><creationdate>20021126</creationdate><title>Fundente para soldar</title><author>ALVIN E. SCHNEIDER ; SANYOGITA ARORA ; KAREN A. TELLEFSEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_BR0016118A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>por</language><creationdate>2002</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>ALVIN E. SCHNEIDER</creatorcontrib><creatorcontrib>SANYOGITA ARORA</creatorcontrib><creatorcontrib>KAREN A. TELLEFSEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ALVIN E. SCHNEIDER</au><au>SANYOGITA ARORA</au><au>KAREN A. TELLEFSEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fundente para soldar</title><date>2002-11-26</date><risdate>2002</risdate><abstract>"FUNDENTE PARA SOLDAR". Um fundente de soldagem inclui uma resina não-ácida em uma composição aquosa. O fundente também pode incluir um agente ativante e um agente tensoativo que promove umedecimento de superfície. O fundente pode ser usado para revestir circuitos e um painel de circuito impresso.
A soldering flux includes a resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printed circuit board. The resin can be non-acidic and/or in an emulsified form.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Fundente para soldar |
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