ELECTROLYTE FOR COPPER PLATING
The electrolyte is used for the copper plating of components for various applications. It has stable characteristics regarding the extended operation of the vats, high throwing power and allows operations at elevated current densities. The electrolyte contains, in g/l: copper sulphate 80-220, sulphu...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | STEFANOV, STEFAN R MIRCHEVA, VERA V PETKOVA, NIKOLINA K SHENKOV, STOJCHO D POPOVA, ILINKA P STOIMENOV, GEORGI B |
| description | The electrolyte is used for the copper plating of components for various applications. It has stable characteristics regarding the extended operation of the vats, high throwing power and allows operations at elevated current densities. The electrolyte contains, in g/l: copper sulphate 80-220, sulphuric acid 60-180, alkaline chloride 0.05-0.1, organic disulphide 0.005-0.01 and polymer 0.005-0.01, the disulphide representing 1:1 mixture of organic aliphatic disulphide 3,3'-disodiumdithiopropansulphonateNaO2S.CH2-CH2-CH2-S-S-CH2-CH2.SO2.Na and nitrogen-containing disulphide 2,2"-dithiodipiridine:with concentration 0.005-0.01 g/l, while the polymer is a n-block copolymer of ethylene and propylene oxide with a concentration of 0.005-0.01 g/l, molecular mass of 3000-400000 and the following general formula:in which n ranges between 5 and 16, m - between 10 and 50 and p - between 10 and 100. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_BG48405A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>BG48405A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_BG48405A13</originalsourceid><addsrcrecordid>eNrjZJBz9XF1Dgny94kMcVVw8w9ScPYPCHANUgjwcQzx9HPnYWBNS8wpTuWF0twMcm6uIc4euqkF-fGpxQWJyal5qSXxTu4mFiYGpo6GxgQVAAD_mSAm</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTROLYTE FOR COPPER PLATING</title><source>esp@cenet</source><creator>STEFANOV, STEFAN R ; MIRCHEVA, VERA V ; PETKOVA, NIKOLINA K ; SHENKOV, STOJCHO D ; POPOVA, ILINKA P ; STOIMENOV, GEORGI B</creator><creatorcontrib>STEFANOV, STEFAN R ; MIRCHEVA, VERA V ; PETKOVA, NIKOLINA K ; SHENKOV, STOJCHO D ; POPOVA, ILINKA P ; STOIMENOV, GEORGI B</creatorcontrib><description>The electrolyte is used for the copper plating of components for various applications. It has stable characteristics regarding the extended operation of the vats, high throwing power and allows operations at elevated current densities. The electrolyte contains, in g/l: copper sulphate 80-220, sulphuric acid 60-180, alkaline chloride 0.05-0.1, organic disulphide 0.005-0.01 and polymer 0.005-0.01, the disulphide representing 1:1 mixture of organic aliphatic disulphide 3,3'-disodiumdithiopropansulphonateNaO2S.CH2-CH2-CH2-S-S-CH2-CH2.SO2.Na and nitrogen-containing disulphide 2,2"-dithiodipiridine:with concentration 0.005-0.01 g/l, while the polymer is a n-block copolymer of ethylene and propylene oxide with a concentration of 0.005-0.01 g/l, molecular mass of 3000-400000 and the following general formula:in which n ranges between 5 and 16, m - between 10 and 50 and p - between 10 and 100.</description><edition>5</edition><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>1991</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910215&DB=EPODOC&CC=BG&NR=48405A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19910215&DB=EPODOC&CC=BG&NR=48405A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>STEFANOV, STEFAN R</creatorcontrib><creatorcontrib>MIRCHEVA, VERA V</creatorcontrib><creatorcontrib>PETKOVA, NIKOLINA K</creatorcontrib><creatorcontrib>SHENKOV, STOJCHO D</creatorcontrib><creatorcontrib>POPOVA, ILINKA P</creatorcontrib><creatorcontrib>STOIMENOV, GEORGI B</creatorcontrib><title>ELECTROLYTE FOR COPPER PLATING</title><description>The electrolyte is used for the copper plating of components for various applications. It has stable characteristics regarding the extended operation of the vats, high throwing power and allows operations at elevated current densities. The electrolyte contains, in g/l: copper sulphate 80-220, sulphuric acid 60-180, alkaline chloride 0.05-0.1, organic disulphide 0.005-0.01 and polymer 0.005-0.01, the disulphide representing 1:1 mixture of organic aliphatic disulphide 3,3'-disodiumdithiopropansulphonateNaO2S.CH2-CH2-CH2-S-S-CH2-CH2.SO2.Na and nitrogen-containing disulphide 2,2"-dithiodipiridine:with concentration 0.005-0.01 g/l, while the polymer is a n-block copolymer of ethylene and propylene oxide with a concentration of 0.005-0.01 g/l, molecular mass of 3000-400000 and the following general formula:in which n ranges between 5 and 16, m - between 10 and 50 and p - between 10 and 100.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1991</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBz9XF1Dgny94kMcVVw8w9ScPYPCHANUgjwcQzx9HPnYWBNS8wpTuWF0twMcm6uIc4euqkF-fGpxQWJyal5qSXxTu4mFiYGpo6GxgQVAAD_mSAm</recordid><startdate>19910215</startdate><enddate>19910215</enddate><creator>STEFANOV, STEFAN R</creator><creator>MIRCHEVA, VERA V</creator><creator>PETKOVA, NIKOLINA K</creator><creator>SHENKOV, STOJCHO D</creator><creator>POPOVA, ILINKA P</creator><creator>STOIMENOV, GEORGI B</creator><scope>EVB</scope></search><sort><creationdate>19910215</creationdate><title>ELECTROLYTE FOR COPPER PLATING</title><author>STEFANOV, STEFAN R ; MIRCHEVA, VERA V ; PETKOVA, NIKOLINA K ; SHENKOV, STOJCHO D ; POPOVA, ILINKA P ; STOIMENOV, GEORGI B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_BG48405A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1991</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>STEFANOV, STEFAN R</creatorcontrib><creatorcontrib>MIRCHEVA, VERA V</creatorcontrib><creatorcontrib>PETKOVA, NIKOLINA K</creatorcontrib><creatorcontrib>SHENKOV, STOJCHO D</creatorcontrib><creatorcontrib>POPOVA, ILINKA P</creatorcontrib><creatorcontrib>STOIMENOV, GEORGI B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>STEFANOV, STEFAN R</au><au>MIRCHEVA, VERA V</au><au>PETKOVA, NIKOLINA K</au><au>SHENKOV, STOJCHO D</au><au>POPOVA, ILINKA P</au><au>STOIMENOV, GEORGI B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTROLYTE FOR COPPER PLATING</title><date>1991-02-15</date><risdate>1991</risdate><abstract>The electrolyte is used for the copper plating of components for various applications. It has stable characteristics regarding the extended operation of the vats, high throwing power and allows operations at elevated current densities. The electrolyte contains, in g/l: copper sulphate 80-220, sulphuric acid 60-180, alkaline chloride 0.05-0.1, organic disulphide 0.005-0.01 and polymer 0.005-0.01, the disulphide representing 1:1 mixture of organic aliphatic disulphide 3,3'-disodiumdithiopropansulphonateNaO2S.CH2-CH2-CH2-S-S-CH2-CH2.SO2.Na and nitrogen-containing disulphide 2,2"-dithiodipiridine:with concentration 0.005-0.01 g/l, while the polymer is a n-block copolymer of ethylene and propylene oxide with a concentration of 0.005-0.01 g/l, molecular mass of 3000-400000 and the following general formula:in which n ranges between 5 and 16, m - between 10 and 50 and p - between 10 and 100.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_BG48405A1 |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | ELECTROLYTE FOR COPPER PLATING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T03%3A46%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=STEFANOV,%20STEFAN%20R&rft.date=1991-02-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EBG48405A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |